New Member Press Releases

nVent Releases Next Generation nVent SCHROFF MicroTCA.4 Crate

nVent Releases Next Generation nVent SCHROFF MicroTCA.4 Crate NEW MTCA.4 Crate achieves 128 Gbits bandwidth per slot with PCIe Gen 5 Enhanced Cooling: Improved rear card cage cooling Future [...]

EKF: CompactPCI® Serial R3 specification is now ratified and available

Hamm, Germany – March 04, 2025: The PICMG (PCI Industrial Computer Manufacturers Group) has released the CompactPCI® Serial R3 specification. Revision 3 is an extension of CompactPCI® technology, [...]

congatec launches COM Express Compact module with brand new Intel® Core™ Ultra processors

Next-generation AI computing for the edge  Deggendorf, Germany, 20 December 2023 * * * congatec – a leading vendor of embedded and edge computing technology – is introducing its latest […]

COMh-caRP and COMh-ccAS: Kontron advances industrial High-Performance Computing

New COM-HPC® Client modules based on 13th Gen Intel® Core™ mobile and desktop processors for demanding multi-core applications Ismaning, Germany, 2023 – Kontron, a leading global provider [...]

Sealevel to Showcase Latest in COM & I/O Portfolio at Embedded World 2023

LIBERTY, SC, USA February 21, 2023 – Sealevel Systems, an industry-leading developer and manufacturer of industrial I/O and embedded computing solutions, will premier its newest solutions at [...]

Member Press Releases

Member Press Releases archive

Zero8 for ModBlox7
DRTM-PZT4