Heitec Announces the embedded system platform HeiSys

From the Idea to the Product

Worldwide first presentation of the embedded system platform HeiSys

Robust and multi-dimensionally scalable, the system can be used as a universal gateway or edge computer for high-speed solutions, for example in IoT or mobile applications

At the embedded world 2020 HEITEC will present its new robust embedded system platform HeiSys for the very first time. The platform is designed for high scalability and maximum flexibility and can be used as universal gateway, box PC or edge computer, especially in IoT applications, but also in other areas. Additionally, HeiSys is certified for medical and industrial applications, mobile use and according to railway regulations.

Plug-on modules are becoming more and more popular in many markets, as they make it relatively easy to even implement solutions with higher performance requirements. With the new embedded system platform, HEITEC combines the advantages of various future-oriented plug-on modules and offers customers a modular basis with standardized interfaces for the rapid and cost-effective realization of their respective applications.

Fast and custom fit solutions through plug-on modules

Based on the use of standards-based processor and FPGA modules, HeiSys can be scaled to the required computing power as well as extended by the needed communication interfaces. Thus, customers have the possibility to flexibly adapt the platform to the individual requirements of their target application or to implement applications with intensive data processing quickly, fail-safe and without much effort. A complicated, time-consuming setup or the costly coordination of various components is no longer necessary.

Depending on the complexity of the design and the requirements for bandwidth, signal diversity, performance and power consumption, a corresponding COM express board can be selected and, in combination with SMARC module-based FPGA boards, a wide variety of interfaces can be mapped via the corresponding FPGA design. In the future, the new COM HPC standard will be supported in addition. Full flexibility regarding wireless transmission technologies is guaranteed via m.2 interfaces. The system platform is also designed for the use of WLAN, LTE, 5G, UMTS, GSM, LPWA, Bluetooth, GPS/GLONASS multiband radio modules for industrial data communication and railway applications. The approval according to EN50155 – applicable to electronic equipment installed in rail vehicles – qualifies the compact system for mobile use as a rolling stock or for wayside monitoring. Due to the absence of moving parts such as fans, the reliability as well as the MTBF are significantly increased. The system guarantees operation in the extended temperature range between -40° and +85° C. An approval according to EN50155 also implies the possibility of underfilling IC’s and protective coating of the boards. The housing can be modularly extended according to customers´ needs, required operating conditions and necessary cooling capacity.


Correspondingly, HEITEC will give a presentation on technical possibilities and limits of the different module standards at the PICMG stand in hall 1, 1-500 on Wednesday, February 26th at 15:30 pm (duration about 15 minutes followed by Q&A).

Further information: www.heitec-electronics.com