The Latest From PICMG
November 29, 2023
PICMG 2023 in Review: Specs, Specs and More Specs
By Jessica Isquith, President, PICMG The end of every calendar year provides an opportunity to reflect on our [...]
November 29, 2023
Cloud-Native Gets An Edge with COM-HPC Server Modules and Manycore Arm SoCs
PICMG executive member ADLINK Technology is redefining the performance per watt equation in computer-on-module [...]
October 9, 2023
PICMG COM-HPC 1.2 “Mini” Brings PCIe 5.0, USB4 & 10 GbE to Far Edge
WAKEFIELD, Mass., October 9, 2023. PICMG, a leading consortium for developing open embedded computing [...]
Latest Member News
March 12, 2023
COMh-caRP and COMh-ccAS: Kontron advances industrial High-Performance Computing
New COM-HPC® Client modules based on 13th Gen Intel® Core™ mobile and desktop processors for demanding [...]
March 12, 2023
Sealevel to Showcase Latest in COM & I/O Portfolio at Embedded World 2023
LIBERTY, SC, USA February 21, 2023 – Sealevel Systems, an industry-leading developer and manufacturer of industrial [...]
March 12, 2023
Accelerating Technology Innovation for Autonomous Driving
ADLINK: Bringing AI-enabled embedded and rugged computing to everyday devices Summary: ADLINK will demonstrate its [...]
Upcoming Events
December 5, 2023
12th MicroTCA Workshop for Industry and Research
April 9, 2024
Embedded World 2024
