The Latest From PICMG
March 2, 2022
PICMG Committee to Develop New Modular Box PC Open Specification
ModBlox7 introduces an open standard to proprietary multi-billion USD market PICMG, a leading consortium for [...]
January 27, 2022
PICMG Releases brand new COM-HPC® Carrier Board Design Guide
The design guide supplements the COM-HPC specification for high performance compute modules Wakefield, MA., 2022 [...]
October 6, 2021
PICMG Ratifies IoT.1 Firmware Specification for Smart IoT connected Sensors and Effecters
PICMG, a leading consortium for the development of open embedded computing specifications, announces the [...]
Latest Member News
April 8, 2022
ADLINK’s Ampere® Altra® Developer Platform with Arm SystemReady certification
A unique COM-HPC reference system that meets developer needs across several markets: cloud, software development, [...]
January 5, 2022
ADLINK launches COM-HPC Client Type and COM Express Type 6 Modules with 12th Gen Intel® Core™ processors
Breakthrough Intel® Core™ technology with ADLINK Computer-on-Modules allow for hybrid architecture [...]
January 5, 2022
congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors
A quantum leap in core count San Diego, Las Vegas/USA, 4 January 2022 * * * congatec – a leading vendor of embedded [...]
