The Latest From PICMG

February 24, 2021
Official Ratification of COM-HPC Specification
The open specification for high performance compute modules is approved by the PICMG Consortium Wakefield, MA., [...]
February 17, 2021
PICMG Announces Officers for 2021 – 2022 Term
Wakefield, Mass., January 2021 – PICMG, a not-for-profit 501(c) consortium of companies and organizations that [...]
January 27, 2021
Plug and Play at the sensor domain (The last foot of the network)
PICMG CTO Doug Sandy presents PICMG industrial IoT initiatives. The video was first presented at Embedded Tech [...]

Latest Member News

December 16, 2020
Avnet Integrated announces robust COM Express™ modules based on Intel’s Atom® x6000E Series for edge computing solutions
Stutensee, Germany – December 2020 – Avnet Integrated presents the scalable MSC C6C-EL COM Express™ [...]
November 26, 2020
congatec introduces new ecosystem for COM-HPC
Important milestone for the COM-HPC integration Deggendorf, Germany, 10 November 2020 * * * congatec – a leading [...]
November 18, 2020
ADLINK’s COM Express Module to Support AMD Ryzen Octa-core V2000 APU
Doubling of core count and 7nm process enables a generational leap in performance Summary: ADLINK has launched the [...]

Upcoming Events

March 1, 2021
Embedded World
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Member Product Directory


congatec AG
COM-HPC high performance module based on 11th Gen Intel® Core™ processor seri… More Info


The CHP-C77-CSA is SECO’s first COM-HPC® / Client module Size A (95 x 120 mm)… More Info


Eurotech S.p.A.
Rugged 11th Gen Intel Core – COM-HPC Client Size A Features 11th Generation In… More Info


Data Modul AG
COM Express Compact Type 6 module with Intel Atom® E3900 series, Pentium® and … More Info


Portwell, Inc.
Features: -Intel® Core™ i7/i5/i3 14nm processor (Comet Lake-S) -2x DDR4-2933 … More Info


Portwell, Inc.
Features: -11th Generation Intel® Core™ processorsdelivering high performance… More Info
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