The Latest From PICMG

February 24, 2021
Official Ratification of COM-HPC Specification
The open specification for high performance compute modules is approved by the PICMG Consortium Wakefield, MA., [...]
February 17, 2021
PICMG Announces Officers for 2021 – 2022 Term
Wakefield, Mass., January 2021 – PICMG, a not-for-profit 501(c) consortium of companies and organizations that [...]
January 27, 2021
Plug and Play at the sensor domain (The last foot of the network)
PICMG CTO Doug Sandy presents PICMG industrial IoT initiatives. The video was first presented at Embedded Tech [...]

Latest Member News

April 14, 2021
EKF Announces new CompactPCI® Serial Backplane Coupler, SCX-PCIE
The SCX-PCIE is a mezzanine side card to EKF CPU boards, for use as a backplane bridge, in order to expand [...]
March 30, 2021
PICMG Releases COM-HPC® Carrier Board Design Guide
The design guide supplements the COM-HPC specification for high performance compute modules  Wakefield, MA., March [...]
March 3, 2021
congatec starter set for COM-HPC™ with 11th Gen Intel® Core™ processors
Getting in the fast lane to Gen4 Deggendorf, Germany, March 2, 2021 * * * congatec – a leading vendor of embedded [...]

Member Product Directory

Computer-on-module for high performance computing

Taking standardized COMs to the next level The long-established COM Express® st… More Info

Trenz Electronic TE0830

Trenz Electronic GmbH
The Trenz Electronic TE0830 is a COM-HPC compatible Zynq UltraScale+ module (12 … More Info

Trenz Electronic TEI0180

Trenz Electronic GmbH
Key Features (PRELIMINARY) – Intel Agilex F-Series FPGA AGFA014R24A3E3VR0 – … More Info

6U CompactPCI 9th Gen Intel Xeon® Core™ Processor Blade with two PMC/XMC sites: cPCI-6540

ADLINK Technology Inc.
‧ 14nm multi-core 9th Gen Intel® Core™ processor (formerly Coffee Lake Refr… More Info
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