The Latest From PICMG
March 12, 2023
A Fresh Look at CompactPCI Serial
A Fresh Look at CompactPCI Serial Contributors: Dolphin, EKF, Elma Electronic and PICMG’s president CompactPCI [...]
March 12, 2023
PICMG COM-HPC Mini working group reaches key milestone in record time
COM-HPC Mini pinout and footprint defined WAKEFIELD, MA., USA. PICMG, a leading consortium for the development of [...]
November 1, 2022
PICMG Ratifies COM-HPC FuSa Extensions, COM Express PCIe 4/USB 4 Updates to Meet Edge Workload Demands
PICMG COM-HPC 1.15 and COM.0 R3.1 continue evolution to support high-performance, mixed-criticality, and [...]
Latest Member News
March 12, 2023
COMh-caRP and COMh-ccAS: Kontron advances industrial High-Performance Computing
New COM-HPC® Client modules based on 13th Gen Intel® Core™ mobile and desktop processors for demanding [...]
March 12, 2023
Sealevel to Showcase Latest in COM & I/O Portfolio at Embedded World 2023
LIBERTY, SC, USA February 21, 2023 – Sealevel Systems, an industry-leading developer and manufacturer of industrial [...]
March 12, 2023
Accelerating Technology Innovation for Autonomous Driving
ADLINK: Bringing AI-enabled embedded and rugged computing to everyday devices Summary: ADLINK will demonstrate its [...]
