Member Press Releases

SECO cuts the edge with the COM-HPC

SECO’s desire to be at the forefront with the newest technologies has led the company to always deliver a broad product portfolio encompassing the latest cutting edge solutions. SECO is [...]

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ADLINK showcased proof-of-concept COM-HPC edge server module at Embedded World 2020

COM-HPC: a new PICMG Computer-on-Module for High Performance Edge Computing The PCI Industrial Computer Manufacturers Group (PICMG) is now entering the final stages in the development of the new [...]

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Heitec Announces the embedded system platform HeiSys

From the Idea to the Product Worldwide first presentation of the embedded system platform HeiSys Robust and multi-dimensionally scalable, the system can be used as a universal gateway or edge [...]

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embedded world 2020: SECO presents its AMD-based solutions

In this edition of embedded world exhibition & conference, SECO will be showcasing many innovative solutions including products based on the latest AMD Ryzen™ Embedded Processors, i.e. [...]

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