Member Press Releases

congatec introduces high-performance COM-HPC carrier board in Micro-ATX form factor

Modular high-end Micro-ATX carrier for more sustainable and ultra-scalable COM-HPC based system designs San Diego, CA, 26 July 2022 * * * congatec – a leading vendor of embedded and edge [...]

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congatec to enter the functional safety market

Functional safe computing platforms for mixed-critical applications Nuremberg/Germany, San Diego/CA, 21 June, 2022 * * * At embedded world Hall 5/Booth 135, congatec – a leading vendor of [...]

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Avnet Embedded integrates 12th Gen Intel® Core™ processors into high-performance COM Express™ Compact module family

Stutensee, Germany – June, 2022 – At embedded world 2022 in hall 3A, booth 135, Avnet Embedded presents the powerful  MSC C6C-ALP COM Express™ Type 6 module family integrating the 12th Gen [...]

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Avnet Embedded presents COM-HPC modules based on 12th Gen Intel® Core™ processors for high-performance computing

Stutensee, Germany – June, 2022 – Avnet Embedded expands its COM-HPC product portfolio for high-performance computing applications and presents the new MSC HCA-ALP client module family in Hall 3, [...]

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