COMh-caRP and COMh-ccAS: Kontron advances industrial High-Performance Computing
March 12, 2023
New COM-HPC® Client modules based on 13th Gen Intel® Core™ mobile and desktop processors for demanding multi-core applications Ismaning, Germany, 2023 – Kontron, a leading global provider [...]
Sealevel to Showcase Latest in COM & I/O Portfolio at Embedded World 2023
March 12, 2023
LIBERTY, SC, USA February 21, 2023 – Sealevel Systems, an industry-leading developer and manufacturer of industrial I/O and embedded computing solutions, will premier its newest solutions at [...]
Accelerating Technology Innovation for Autonomous Driving
March 12, 2023
ADLINK: Bringing AI-enabled embedded and rugged computing to everyday devices Summary: ADLINK will demonstrate its complete autonomous driving solution at Embedded World 2023 Hall 3, booth 147 [...]
Zero8 for ModBlox7
March 12, 2023
ept connector selected for use in the new specification by the PICMG® The demand for modular industrial PCs is high and will continue to grow – a fact that market analyses confirm. For this [...]
Recent
- March 12, 2023 - Avnet Embedded launches powerful module family in the COM Express Compact form factor with 13th Gen Intel Core processor
- January 31, 2023 - EKF Elektronik announces CompactPCI processor boards with 11th Gen Intel Core and Xeon processors
- January 11, 2023 - congatec introduces new Computer-on-Modules with 13th Gen Intel Core processors
- January 11, 2023 - ADLINK releases COM Express and COM-HPC modules based on Intel® 13th Gen Core™ processors — delivering up to 24 cores for extended power ranges with industrial-grade stability
- January 11, 2023 - SECO launches COM Express Type 6 module based on 13th Gen Intel Core Processors
