Member Press Releases

COMh-caRP and COMh-ccAS: Kontron advances industrial High-Performance Computing

New COM-HPC® Client modules based on 13th Gen Intel® Core™ mobile and desktop processors for demanding multi-core applications Ismaning, Germany, 2023 – Kontron, a leading global provider [...]

Read More

Sealevel to Showcase Latest in COM & I/O Portfolio at Embedded World 2023

LIBERTY, SC, USA February 21, 2023 – Sealevel Systems, an industry-leading developer and manufacturer of industrial I/O and embedded computing solutions, will premier its newest solutions at [...]

Read More

Accelerating Technology Innovation for Autonomous Driving

ADLINK: Bringing AI-enabled embedded and rugged computing to everyday devices Summary: ADLINK will demonstrate its complete autonomous driving solution at Embedded World 2023 Hall 3, booth 147 [...]

Read More

Zero8 for ModBlox7

ept connector selected for use in the new specification by the PICMG® The demand for modular industrial PCs is high and will continue to grow – a fact that market analyses […]

Read More
Member Press Releases Archive >