Purchase Specifications

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Specifications available for purchase appear below. You will receive a watermarked PDF upon receipt of payment.

Showing 1–16 of 55 results

Specification Name	Specification #	Quantity	Purchase
COM-HPC Platform Management Interface Specification	COM-HPC_PMI	Quantity
COM Express® Module Base Specification Rev 3.1	COM.0 R3.1	Quantity
COM-HPC Embedded EEPROM Specification	EEEP_COM-HPC	Quantity
MicroSAM Base Specification	MICROSAM	Quantity
Enhancements for MicroTCA.4	MicroTCA.4.1 R1.0	Quantity
PCI-ISA Card Edge Connector for Single Board Computer Specification	PICMG 1.0 R2.0P	Quantity
PCI-PCI Bridge Board Connector for Single Board Computer Specification	PICMG 1.1 R1.0P	Quantity
Embedded PCI-X (ePCI-X) for Standard Form Factor PCI Specification	PICMG 1.2 R1.0P	Quantity
System Host Board PCI Express Specification	PICMG 1.3 R1.0P	Quantity
CompactPCI® Core Specification, with PICMG ECN 002 on Self-Describing Slot Geography	PICMG 2.0 R3.0P	Quantity
CompactPCI® Hot Swap Specification	PICMG 2.1 R2.0P	Quantity
Keying of CompactPCI® Boards and Backplanes Specification	PICMG 2.10 R1.0P	Quantity
CompactPCI® Power Interface Specification	PICMG 2.11 R1.0P	Quantity
Hot Swap Infrastructure Interface Specification	PICMG 2.12 R2.0P	Quantity
CompactPCI® Multicomputing Specification	PICMG 2.14 R1.0P	Quantity
PCI Telecom Mezzanine/Carrier Card Specification	PICMG 2.15 R1.0P	Quantity