CompactPCI® Hot Swap Specification


The primary objective of this specification is to extend CompactPCI® to Hot Swap applications. Hot Swap defines a process for installing and removing boards without adversely effecting a running system. CompactPCI® Hot Swap allows board vendors and platform vendors to add functionality and cost incrementally to a system.

Ratified: January 17, 2001
SKU: PICMG 2.1 R2.0P Category: