congatec – a leading vendor of embedded and edge computing technology – presents a brand new COM-HPC™ starter set at embedded world 2021 DIGITAL. Optimized for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2×25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel® Core™ processor technology (code name Tiger Lake). This new high-end embedded module generation targets system engineers working on the broadband connected edge devices that are emerging in industrial IoT. Target markets include medical, automation, transportation and autonomous mobility, as well as vision based inspection and video surveillance systems, to name just a few.
congatec starter set for COM-HPC™ with 11th Gen Intel® Core™ processors
Keeping COMs cool – This video is a step by step guide on how to mount congatec cooling solutions on to COM Express Type 7, 6 and 2.
More about cooling solutions here: https://bit.ly/32aR55x
How to mount congatec cooling solutions (COM Express Type 7, 6 and 2)
ADLINK nanoX-EL supports 6th generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. nanoX-EL modules support In-Band ECC DDR4 memory up to 16GB, TCC and 2.5GbE with optional TSN and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require reliability at all times. https://www.adlinktech.com/Products/C…
Embedded Intel ATOM x6000E (Elkhart Lake) based COM Express Type 10 Mini size module and devkit
The TQMx110EB offers a new class of computing, graphics and system performance based on high-end mobile computing processors. The 11th generation Intel® Core™ processors are based on the latest microarchitecture and are particularly energy-efficient thanks to the 10nm manufacturing process. Equipped with up to 8 cores / 16 threads, 24 MB cache and powerful Intel® Iris® Xe graphics (12th generation), the module is particularly suitable for demanding applications in the fields of gaming, infotainment/entertainment, virtual reality, medical technology and industrial automation. A special focus is also on AI and image processing. Speaker: Harald Maier, Product & Business Management x86, TQ-Group
COM Express Basic Embedded Module with latest 11th Generation Intel Core Processors “Tiger Lake H”
Advantech: Performance boost with COM-HPC
Samtec COM-HPC® Interconnects from Samtec on Vimeo.
The development of COM-HPC® exceeds the demand for high-speed performance in embedded computers, and provides scalability for next-gen embedded system designs. Samtec interconnects included in this standard offer 5 mm and 10 mm stack heights, a 400 pin open-pin-field on 0.635 mm pitch, BGA attach, and up to 112 Gbps PAM4 performance. Please watch the video to learn more.
Samtec COM-HPC® Interconnects
Come to understand the new specification and experience the performance boost with Advantech new COM-HPC Server Module, SOM-8990 with Intel Skylake-D CPU in size E form factor!
Find out what’s so special about Advantech SOM-8990 – the latest COM-HPC server module
In this video, Christian Eder, the Chairperson of the COM-HPC Technical committee and Director of Marketing for congatec explains not only why there is a need for a new spec, but how it was developed.