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In this video, Kontron’s Stefan Milnor starts out explaining in general terms how a spec gets written. Then he details how that translated to the new COM-HPC specification, which is written under the guidelines of PICMG.
COM-HPC Academy: Open Specification Development Process
In this video, delivered by Max Chi of Advantech, you will learn how to harness and maximize that performance for your specific Industrial IIoT and edge applications. He provides a strong overview of Client modules (Size A, B & C).
COM-HPC Academy: The Journey to COM-HPC Client Modules
In this video, Chris Engels, a Product Marketing Manager for Avnet Integrated/MSC, explains how to design the carrier board for this new, high-performance specification. He goes through both the mechanical and the electrical specifications.
COM-HPC Academy: COM-HPC Carrier Design Considerations
In this video, Henk van Bremer, Director of Boards and Modules at ADLINK, focuses on the server module, which solves many of the issues associated with bringing server level computing to the edge, especially the power that’s needed to drive some of the latest microprocessors.
COM-HPC Academy: Introduction to COM-HPC Server
In this video, Burrell Best, Industry Standards Manager at Samtec, explains the technical considerations and architectural decisions that helped define the COM-HPC electromechanical interface. He details key power management and signal integrity considerations that influenced pinout, pin counts, next-gen connector design and channel topologies.
COM-HPC Academy: Delivering Bleeding Edge Power and Performance
In this video, Jens Hagemeyer and Martin Kaiser from Bielefeld University explain how the COM-HPC platform management portion of the standard was developed and the thinking that went into it. The second portion of the video discusses COM-HPC for non-x86 architectures including ARM, RISC-V, GPUs, and FPGAs.
COM-HPC Academy: Platform Management and Heterogeneous Computing Architectures
congatec Product Manager Andreas Bergbauer explains us his view of the congatec’s modules based on the 11th Gen Intel® Core™ processors (Intel Tiger Lake) feature high-performance CPU/GPU computer with integrated AI acceleration for critical applications that demand high-speed processing and computer vision.
congatec: 11th Gen Intel® Core™ processors with two new design options – COM Express & COM-HPC
PICMG CTO Doug Sandy presents PICMG industrial IoT initiatives. The video was first presented at Embedded Tech Trends 2021.
