Video


In this video, Henk van Bremer, Director of Boards and Modules at ADLINK, focuses on the server module, which solves many of the issues associated with bringing server level computing to the edge, especially the power that’s needed to drive some of the latest microprocessors.

COM-HPC Academy: Introduction to COM-HPC Server


In this video, Burrell Best, Industry Standards Manager at Samtec, explains the technical considerations and architectural decisions that helped define the COM-HPC electromechanical interface. He details key power management and signal integrity considerations that influenced pinout, pin counts, next-gen connector design and channel topologies.

COM-HPC Academy: Delivering Bleeding Edge Power and Performance


In this video, Jens Hagemeyer and Martin Kaiser from Bielefeld University explain how the COM-HPC platform management portion of the standard was developed and the thinking that went into it. The second portion of the video discusses COM-HPC for non-x86 architectures including ARM, RISC-V, GPUs, and FPGAs.

COM-HPC Academy: Platform Management and Heterogeneous Computing Architectures


 

Advantech (Headquarters Taiwan) and Advantech Technologies (formerly Nogata, Nogata City, Fukuoka Prefecture) are promoting the spread of “COM-HPC” , a high-performance COM . Advantech SOM-8990 is finally released! In Japan as well, Advantech Technologies has started to support evaluation machine samples for users in Japan. We not only sell boards, but also support Made In Japan custom services including carrier board development

 

Unboxing COM HPC, Advantech SOM-8990 Eval-Kit in Japan ATJ

Applications such as artificial intelligence and the upcoming 5G wireless standard come with enormous data hunger and require more computing power. This also requires new concepts for embedded computers: existing standards will no longer be sufficient to cope with the growing embedded market demands. Leading manufacturers in the industry, such as Kontron, have set up a new working group in the PICMG standardization committee to make the COM standard fit for the future. Computer-On-Modules High Performance Computing – COM HPC – will be complementary to the existing COM Express® standard.

Kontron: New COM-HPC Standard

congatec Product Manager Andreas Bergbauer explains us his view of the congatec’s modules based on the 11th Gen Intel® Core™ processors (Intel Tiger Lake) feature high-performance CPU/GPU computer with integrated AI acceleration for critical applications that demand high-speed processing and computer vision.

congatec: 11th Gen Intel® Core™ processors with two new design options – COM Express & COM-HPC

PICMG CTO Doug Sandy presents PICMG industrial IoT initiatives. The video was first presented at Embedded Tech Trends 2021.

Plug and Play at the sensor domain (The last foot of the network)

Jan Marjonovic presentation – Chisel Community Conference 2020

Tester for Multi-port Chisel Modules with Bus Functional Models Copy