Applications such as artificial intelligence and the upcoming 5G wireless standard come with enormous data hunger and require more computing power. This also requires new concepts for embedded computers: existing standards will no longer be sufficient to cope with the growing embedded market demands. Leading manufacturers in the industry, such as Kontron, have set up a new working group in the PICMG standardization committee to make the COM standard fit for the future. Computer-On-Modules High Performance Computing – COM HPC – will be complementary to the existing COM Express® standard.

Kontron: New COM-HPC Standard

congatec Product Manager Andreas Bergbauer explains us his view of the congatec’s modules based on the 11th Gen Intel® Core™ processors (Intel Tiger Lake) feature high-performance CPU/GPU computer with integrated AI acceleration for critical applications that demand high-speed processing and computer vision.

congatec: 11th Gen Intel® Core™ processors with two new design options – COM Express & COM-HPC

PICMG CTO Doug Sandy presents PICMG industrial IoT initiatives. The video was first presented at Embedded Tech Trends 2021.

Plug and Play at the sensor domain (The last foot of the network)

COM-HPC™ is a new Computer-on-Module standard designed specifically for High-Performance Computing. It does not replace the COM Express standard, but extends the Computer-on-Module idea to very powerful client and server-class processors, providing an unmatched infrastructure of high-end interfaces.COM-HPC is governed by the PICMG industrial group where it has recently been created by an international workgroup consisting of COM manufacturers including Avnet Integrated, semiconductor companies and infrastructure providers.

COM-HPC™ by Avnet Integrated | Designed by Avnet Integrated‎

ADLINK COM Express Type 6 compact size cExpress-AR module features AMD Ryzen™ Embedded V2000 Series SoC with high-performance integrated AMD Radeon™ graphics. The cExpress-AR is the first Type 6 module on the market to support an AMD Ryzen Embedded 8 CPU core embedded SoC, with up to 16 threads and an impressive turbo boost up to 4.2 GHz. Compared to earlier quad-core AMD Ryzen Embedded V1000 Series SoC, the additional cores combined with the AMD “Zen 2” cores result in 15% IPC uplift, and double the performance-per-watt efficiency.

ADLINK’s cExpress-AR provides standard support for up to 64GB DDR4 in two SO-DIMMs. ECC memory support is available on selected SKUs as well as configurable TDP (down to 10W), while still offering 6 to 8 cores and passive cooling, making the V2000 Series well suited for mission critical application in harsh environments.

For further information about cExpress-AR, please visit:…


COM Express module supporting AMD Ryzen V2000 octa-core (8 core) SoC

Jan Marjonovic presentation – Chisel Community Conference 2020

Tester for Multi-port Chisel Modules with Bus Functional Models Copy

New state-of-the-art Computer-on-Modules – The feature set in detail. congatec supports the 11th Gen Intel® Core™ processor, known under the code name Tiger Lake UP3, on COM Express conga-TC570 based on the new low-power high-density SoCs the new modules offer significantly greater CPU performance and nearly 3x higher GPU performance along with state-of-the-art PCIe Gen4.

conga-TC570 – high-performance COM Express based on 11th Gen Intel® Core™ processors

Hardware management is needed in applications that require high system availability with minimum downtime. Our experts will give a short introduction about Hardware Management technology for open standards such as AdvancedTCA, MicroTCA and VPX.

Episode 6: nVent SCHROFF Hardware Management Capabilities