COM-HPC

New standard boosts performance, design flexibility, efficiency, and ecosystem expansion  Wakefield, Mass. – March 10, 2026 – PICMG, a leading consortium for modular open standards in embedded computing, today released the COM-HPC® revision 1.3 specification. The 1.3...

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Highlights: The multi-part virtual event will show attendees how to take advantage of PICMG’s next-generation computer on module specification family for intelligent edge use cases. Sessions will address how the...

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Highlights: Carrier Design Guide helps hardware engineers design application-specific carrier boards for COM-HPC-based systems. Revision 2.2 of the Carrier Design Guide introduces new diagrams, figures, and design notes for COM-HPC...

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The Members Only interview series highlights leaders from within PICMG and throughout the open standards development community. We recognize their contributions and seek insight into their thought processes and strategies...

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By Jessica Isquith, President, PICMG The end of every calendar year provides an opportunity to reflect on our achievements and shortcomings. But as 2023 draws to a close, I’m nothing...

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