• New standard boosts performance, design flexibility, efficiency, and ecosystem expansion 

Wakefield, Mass. – March 10, 2026 – PICMG, a leading consortium for modular open standards in embedded computing, today released the COM-HPC® revision 1.3 specification. The 1.3 revision further advances the high-performance Computer-on-Module (COM) standard to address evolving requirements in edge computing, industrial automation, medical technology, and high-performance applications.  

The new enhancements position COM-HPC as a future-ready standard for memory-centric and accelerator-based architectures, advancing new designs in embedded computing technology. 

Technical Advancements for High-Performance Embedded Computing 

• Support for PCI Express Gen 6 and CXL: A key enhancement of revision 1.3 is support for PCI Express (PCIe) Gen 6, including additional signal budget definitions to meet increasing demands for data throughput and signal integrity. The specification also adds support for Compute Express Link (CXL), enabling high-bandwidth, coherent connectivity for memory and accelerator resources over the PCIe interface. 

• Ecosystem Expansion: Mechanical updates further strengthen the ecosystem. New connector options — including non-BGA column-type variants — as well as additional approved connector suppliers such as Samtec, Amphenol, Hirose, and All Best, enhance supply chain flexibility and availability. 

• Expanded Functionality: The revision adds support for C-PHY on MIPI-CSI, particularly relevant for camera and vision applications. An additional clock input supports the connection of 2×2 camera configurations for D-PHY. 

• Improved Energy Efficiency: A new key feature is the introduction of Modern Standby (S0ix), which enables COM-HPC modules to better support energy-efficient operating modes. Bidirectional PCIe clock request signals support more efficient power management, and clock inputs support configuration as clock outputs. These enhancements simplify system design and improve signal routing in complex implementations. 

• I/O Expansion: Revision 1.3 refines the use of GPIOs, which can now be preferentially assigned, for example, to monitor system states or control external devices. The new revision further defines an additional I2S interface, significantly enhancing audio capabilities. Moreover, the DC input range has been expanded to enable new electrical design options, including server-class applications. Optionally, the SMBus can now be used as an additional I2C interface. 

Industry Voices
“Our support of the COM-HPC revision 1.3 is the next step in our ongoing commitment to continuous improvement,” said Christian Eder, director market intelligence at congatec and chairman of the PICMG COM-HPC working group. “Revision 1.3 expands vital functionality while fully preserving backward-compatibility, and that’s important for customers who want to upgrade systems, even if they are already in the field.”  

“COM-HPC 1.3 is the result of close collaboration across the embedded ecosystem,” said Matthew Burns, director of technical marketing at Samtec and secretary of the COM-HPC working group. “The expertise of our signal integrity specialists proved instrumental in integrating PCIe 6.0 design guidelines into the specification.” 

“COM-HPC 1.3 demonstrates how open standards can accelerate innovation,” said Joel Finkel, editor of the COM-HPC working group. “Its combination of new connectivity, higher performance, and greater design flexibility make this standard especially attractive for next-generation high-performance platforms.” 

Meet PICMG at embedded world Nuremberg 2026: 

PICMG executive officers and member companies invite attendees to the PICMG Booth 3-264 during exhibition hours: March 10-11 from 9:00 a.m.-6:00 p.m., March 12 from 9:00 a.m.-5:00 p.m. 

PICMG will also host a networking reception and panel sessions on Wednesday, March 11 at 13:00 UTC in the Mitte entrance that covers the latest innovations in COM-HPC 1.3. Attendance is by invitation only. Contact marketing officer, Brandon Lewis, at [email protected] for more information. 

About PICMG
Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high-performance industrial, industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 150 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single-board computer design, high-speed signaling design and analysis, networking expertise, backplane and packaging design, power management, high-availability software, and comprehensive system management. 

Key standards families developed by PICMG include COM-HPC, COM Express, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, InterEdge, ModBlox7, SHB Express, MicroSAM, and HPM (Hardware Platform Management). For more information, visit https://www.picmg.org, or follow PICMG on LinkedIn and X (formerly Twitter). 

Media Contacts:
PICMG 
Jessica Isquith
[email protected]  

ThroughPut Marketing
Coline Pourtier
[email protected] 

Highlights:

• The multi-part virtual event will show attendees how to take advantage of PICMG’s next-generation computer on module specification family for intelligent edge use cases.
• Sessions will address how the Mini form factor enhances performance in mobile-friendly deployments, new features like the updated COM-HPC connector, and a new Carrier Design Guide.
• Attend for free on June 4^th at 14:00 UTC at https://t.ly/COM-HPCMiniAcademy.

MAY 29, 2024 — WAKEFIELD, MA. PICMG, the consortium driving open standards for modular, scalable computing, will be hosting a COM-HPC Mini Academy on Tuesday, June 4 at 14:00 UTC. This multi-part virtual event will span four sessions and introduce participants to the new COM-HPC Mini form factor’s features, including details of the Mini’s updated Carrier Design Guide, as well as examine use cases, design questions, and deployment challenges.

“Between converged network rollouts and advances in artificial intelligence, the hardware requirements for edge computing have changed,” said Doug Sandy, CTO of PICMG. “Modern edge workloads need a combination of high-end computing, power consumption management, and low-latency data transmission. The COM-HPC Mini addresses these requirements, and our Mini Academy will teach developers everything they need to know about how the specification brings the intelligent edge to life.”

The event will be divided into four sessions covering the following topics:

• How COM-HPC Mini improves performance in mobile-friendly deployments.
• The importance of support for CPU, GPU, FPGA and heterogenous processor architectures in diverse edge applications.
• Details on new features in COM-HPC and how they enable greater bandwidth, lower latency, more rugged designs, and interoperable high-speed chip-to-memory interconnects.
• How the updated Carrier Design Guide streamlines development and deployment of cost-optimized, low-to-mid volume production runs.

More details on each session can be found below:

Session 1: June 4^th at 14:00 UTC—What’s New in COM-HPC?

The first Mini Academy session, co-hosted by representatives from congatec, Samtec, and the University of Bielefeld, provides an update on COM-HPC and how it can help organizations transform their edge infrastructure. Alongside updates to the COM-HPC specification family, the session will explore potential PCIe Gen 6 support, CXL 3.1 compatibility, and Functional Safety (FuSa) capability.

Session 2: June 4^th at 14:30 UTC—Introducing COM-HPC Mini

Co-presented by Richard Pinnow of ADLink and Christian Engels of Avnet Embedded, this session will detail how COM-HPC Mini provides system architects with greater speed and performance in a smaller form factor. Participants can expect a review of the new specification’s electromechanical features, followed by demonstrations of how they can leverage those features for far edge mobile and battery powered use cases, such as AMRs, HMIs, drones, and robotic controllers.

Session 3: June 4^th at 15:00 UTC—Exploring the COM-HPC Mini Design Guide

Presented by Kontron’s Peter Hunold, this session introduces the updated Carrier Design Guide developed specifically for the COM-HPC Mini specification. Participants will be given an overview of how the COM-HPC Design Guide has changed from previous versions. The session will conclude by demonstrating how to design in advanced signals, like multiplexed USB 4.0 and how to quickly and efficiently produce Gerber files that define lasting COM-based systems.

Session 4: June 4^th at 15:30 UTC—The COM-HPC Mini Academy: A Multi-Vendor Outlook Panel

Co-hosted by several of the suppliers responsible for developing the COM-HPC Mini specification, this discussion panel will field questions from attendees about designing and deploying the new standard. Participants will also learn about the differences between COM Express and COM-HPC, along with best practices for designing the COM-HPC Mini into real-world applications. The session will then conclude with insight into PICMG’s technology roadmaps.

Going Beyond the Intelligent Edge

“First ratified in 2021, COM-HPC was designed to address the challenges and fulfill the requirements of embedded system architects,” explained Sandy. “COM-HPC Mini continues this trend, introducing a new form factor and features like expanded connectivity support, efficient thermal management, and soldered memory.”

“Open, interoperable, and available from multiple suppliers, COM-HPC Mini provides a path forward for edge computing that will remain relevant for decades,” he added, inviting anyone interested in learning more about COM-HPC Mini and other specifications to visit PICMG’s website.

Recordings of the COM-HPC Mini Academy sessions will be available on-demand for those unable to attend the live event.

Learn More

• Event Registration: https://t.ly/COM-HPCMiniAcademy
• COM-HPC Overview: https://www.picmg.org/openstandards/com-hpc/
• Carrier Design Guide: https://www.picmg.org/wp-content/uploads/PICMG_COM-HPC_CDG_R2_1.pdf
• COM-HPC Mini: https://www.picmg.org/openstandards/com-hpc

About PICMG

Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 150 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, COM-HPC Mini, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, InterEdge, ModBlox7, SHB Express, MicroSAM, and HPM (Hardware Platform Management). For more information, visit https://www.picmg.org.

Highlights:

• Carrier Design Guide helps hardware engineers design application-specific carrier boards for COM-HPC-based systems.
• Revision 2.2 of the Carrier Design Guide introduces new diagrams, figures, and design notes for COM-HPC Mini.
• Document contains technical materials such as interface schematics and practical guidance on design rules.

WAKEFIELD, MA. PICMG, a consortium for open hardware specifications, has released revision 2.2 of the COM-HPC Carrier Design Guide. This comprehensive document contains interface schematics, diagrams, design rules and requirements, and more for PCB layout engineers and hardware developers looking to create application-specific carrier boards that pair with COM-HPC modules.

Revision 2.2 of the Design Guide includes updates to address the new COM-HPC 2.1 specification, nicknamed COM-HPC Mini, which is the 95 mm x 60 mm platform that uses one less connector compared to its fellow COM-HPC form factors, but still delivers 400 pins for carrying high-speed signals from the processor module to carrier boards.

“Designing a carrier board can be a complex and time-consuming process, but the COM-HPC Design Guide helps streamline that process” says Peter Hunold, head of hardware engineering at Kontron Europe GmbH and editor of the COM-HPC working group. “It serves as an excellent complement to the COM-HPC base specification, as well as, for revisions like COM-HPC 2.1 that introduced the new “Mini” form factor and vendor documentation.”

What’s New in COM-HPC Carrier Design Guide Revision 2.2

Revision 2.2 of the Carrier Board Design Guide primarily focuses on the COM-HPC Mini, a small form factor expansion of the COM-HPC standard first announced in 2022. This new guide clarifies the differences between COM-HPC Client and COM-HPC Mini carrier board requirements, with examples that illustrate modifications necessary to move from Client- to Mini-compatible designs.

The Design Guide 2.2 release also introduces information on the Intel JHL9040R USB4 Retimer, which replaces the JHL8040R in Rev 2.1. In addition to updated references, the document includes Intel JHL9040R block diagrams for both COM-HPC Client and COM-HPC Mini designs.

“Designing hardware to support new and emerging workloads is becoming progressively more challenging. Open standards such as COM-HPC help businesses overcome those challenges,” says Christian Eder, director of market intelligence at congatec. “They considerably reduce time-to-market for even the most sophisticated applications, especially with documentation to streamline the design process.”

Learn More

The COM-HPC Carrier Design Guide revision 2.2 can be downloaded free of charge from PICMG’s website. For more information on the Design Guide, the COM-HPC standard, and other related specifications, visit:

• COM-HPC Design Guide Revision 2.2: https://www.picmg.org/wp-content/uploads/PICMG_COMHPC_CDG_R2_2.pdf
• COM-HPC Specification Documents: https://www.picmg.org/shop/
• COM-HPC Overview: https://www.picmg.org/openstandards/com-hpc/
• PICMG Design Guides: https://www.picmg.org/resources/design-guides/

About PICMG

Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high performance industrial, Industrial IoT, process control and automation, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 150 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single board computer design, high-speed signaling design and analysis, networking expertise, backplane, and packaging design, power management, high availability software and comprehensive system management.

Key standards families developed by PICMG include COM-HPC, COM Express, CompactPCI, CompactPCI Serial, MicroTCA, AdvancedMC, AdvancedTCA, InterEdge, ModBlox7, HPM (Hardware Platform Management), MicroSAM, and SHB Express. For more information, visit https://www.picmg.org.