PICMG: Can you describe your work outside of PICMG as well as the role you played in development of the COM-HPC specification? 

JENS: I am currently engaged in research at Bielefeld University, focusing on the development of heterogeneous and reconfigurable computing technologies for a wide range of applications. These include the Internet of Things (IoT), edge computing, cloud computing, and high-performance computing (HPC).

My involvement with the early stages of the COM-HPC specification centered on leading the development of the Platform Management Interface Specification and expanding the Embedded EEPROM Specification for COM-HPC. 

PICMG: You recently raised awareness about the CXL standard within the COM-HPC community. What is CXL and why is it relevant for PICMG COM-HPC developers and users?

JENS: CXL, or Compute Express Link, is a high-speed, high-capacity interconnect standard that facilitates efficient communication between CPUs, memory, and peripherals using the PCIe physical layer. Its support for cache coherency, disaggregation, and scalable architectures makes it a compelling choice for modular form factors like COM-HPC, driving its popularity among developers and users seeking advanced computing solutions.

PICMG: Why is CXL 3.1 significant in the context of COM-HPC? What use cases or capabilities will it drive in the COM-HPC ecosystem?

JENS: CXL introduces features that cater to the demanding requirements of cloud and high-performance computing systems. Its emphasis on scalable architectures, disaggregation, and cache coherency is particularly relevant for COM-HPC, offering the potential to revolutionize the way modular computing platforms are designed and utilized. 

The integration of CXL into COM-HPC could facilitate the development of more sophisticated computing solutions, enabling the seamless coupling of specialized accelerators and the establishment of cache-coherent multi-socket systems. These advancements promise to unlock new possibilities for COM-HPC applications, ranging from data-intensive analytics to AI and machine learning workloads, driving innovation in modular computing technologies.

PICMG: Given that CXL targets PCIe, has it been compatible with COM-HPC to date?

JENS: The relationship between CXL and COM-HPC is fundamentally influenced by CXL’s reliance on the PCIe physical layer for connectivity. This means that while direct compatibility between previous versions of CXL and COM-HPC has not been explicitly defined, the architectural underpinnings allow for potential integration. 

The absence of CXL in the current COM-HPC specification, coupled with the lack of support in existing modules, suggests that the integration of CXL represents a forward-looking opportunity for enhancing COM-HPC. Such integration is anticipated to require minimal modifications to the specification, paving the way for future advancements in modular computing.

PICMG: What does the COM-HPC community need to know about the CXL market or technical requirements to capitalize on the opportunity?

JENS: To fully leverage the potential that CXL brings to the COM-HPC community, it is crucial to understand the intricacies of CXL’s market dynamics and technical specifications. This involves a deep dive into the architecture of CXL, including its device types—such as Type 1 for I/O devices, Type 2 for cache-coherent devices, and Type 3 for memory expander devices. Additionally, understanding the topology options that CXL supports, including switch-based topologies for larger, more complex systems, can empower developers to design COM-HPC solutions that are both innovative and future-proof. 

Staying abreast of the evolving CXL specifications and market trends will enable the COM-HPC community to identify new opportunities for integration and application, ensuring that COM-HPC modules remain at the forefront of technological advancement.

PICMG: What are you and Bielefeld University doing with respect to CXL today?

JENS: We are working on integrating CXL within the RISC-V ecosystem, a venture that holds promising implications for the future of computing architectures. Our work focuses on the development of innovative bridge technologies that facilitate communication between the RISC-V Coherent Hub Interface (CHI) and CXL, using FPGA-based modules, which we refer to as microservers. 

This endeavor is not just about bridging two technical standards; it’s about creating a foundation for next-generation computing platforms that can seamlessly integrate diverse processing and memory resources. By developing these bridges, we aim to enable more efficient, scalable, and flexible computing architectures that can cater to the demanding requirements of modern applications, ranging from AI and machine learning to big data analytics.

PICMG: Where can interested parties go to find more information on CXL?

JENS: The CXL Consortium website serves as the primary repository of knowledge. This platform not only provides access to the official CXL specifications and technical documents, but also offers insights into the latest developments, industry adoption stories, and educational resources.

More Information:
• Compute Express Link: https://computeexpresslink.org
•*PICMG COM-HPC Overview: https://www.picmg.org/openstandards/com-hpc
•*PICMG Platform Management Interface Specification: https://www.picmg.org/product/com-hpc-platform-management-interface-specification

Next-generation AI computing for the edge 

Deggendorf, Germany, 20 December 2023 * * * congatec – a leading vendor of embedded and edge computing technology – is introducing its latest range of COM Express Compact modules based on the Intel^® Core™ Ultra processors. Providing a unique combination of heterogeneous compute engines, including CPU, GPU and NPU, the new modules are an ideal fit to run demanding AI workloads at the edge.

Next to the powerful P-cores and efficient E-cores for general computing and the high-performance Intel^® Arc™ GPU for graphics-intensive tasks, the integrated Neural Processing Unit (NPU) called Intel^® AI Boost contributes advanced neural processing capabilities to the overall computational architecture. The integrated NPU enables highly efficient integration of advanced artificial intelligence workloads at lower system complexity and costs than discrete accelerators. This makes the new Intel Core Ultra processor-based Computer-on-Modules especially beneficial for combining high-performance real-time computing with powerful AI capabilities in surgery robots and medical imaging and diagnostic systems, where automatically generated critical findings can support medical personnel. Other application targets are situational awareness in industrial applications such as inspection systems, stationary robotic arms, autonomous mobile robots (AMRs), and autonomous guided vehicles (AGVs), to name just a few.

“The new conga-TC700 COM Express Compact Computer-on-Modules provide application-ready AI capabilities in a plug-and-play form factor. Its ecosystem of customer solution-focused products and services significantly improves the time-to-market for implementing the latest state-of-the-art x86 with powerful AI capabilities as required in industrial process control, microgrid controller, medical ultrasound and x-ray, automated check-out terminals, powerful AMRs, and many more,” says Tim Henrichs, VP Global Marketing & Business Development at congatec. “OEMs can simply upgrade existing applications by exchanging the module and instantly gain access to cutting-edge AI technologies. It has never been easier to integrate artificial intelligence in x86-based systems.”

The feature set at a glance

The new conga-TC700 COM Express Compact Computer-on-Modules with Intel Core Ultra processors (code named Meteor Lake) are among the most power-efficient x86 client SoCs available on the market. Up to 6 P-Cores, up to 8 E-Cores, and 2 Low Power E-Cores support up to 22 threads, making it possible to consolidate distributed devices onto a single platform for the lowest total cost of ownership. The SoC-integrated Intel Arc GPU with up to 8 Xe Cores and up to 128 EUs can handle stunning graphics up to 2x 8K resolution and ultra-fast GPGPU-based vision data (pre)processing. The integrated NPU Intel AI Boost executes machine learning algorithms and AI inferences particularly efficient. Up to 96 GB DDR SO-DIMM with in-band ECC at 5600 MT/s contributes to power-efficient high data throughput and low latency.

The modules are supported by congatec’s OEM solution-focused high-performance ecosystem, including highly efficient active and passive cooling solutions and ready-to-use evaluation carrier boards. Customers can order the modules with pre-evaluated real-time hypervisor technology from Real-Time Systems for virtual machine deployments and workload consolidation in edge computing scenarios. Service offerings include shock and vibration tests for custom system designs, temperature screening, and high-speed signal compliance testing, along with design-in services and all required training sessions to simplify the use of congatec’s embedded computer technologies to round off the ecosystem.

The new conga-TC700 COM Express Compact Type 6 modules support the embedded temperature range from 0 °C to 60 °C and are available in the following standard configurations:

All features of the new Intel Core Ultra processor-based conga-TC700 COM Express Compact modules can be found here: https://www.congatec.com/en/products/com-express-type-6/conga-tc700/

For more information on the innovative Intel Core Ultra processor platform please visit https://www.congatec.com/en/technologies/intel-meteor-lake-h-based-computer-on-modules/

You can experience these and other innovations at embedded world from 9-11 April 2024: https://www.congatec.com/en/congatec/events/congatec-at-embedded-world-2024/

Visit congatec in Hall 3 at Stand 241

* * *

About congatec 

congatec is a rapidly growing technology company focusing on embedded and edge computing products and services. The high-performance computer modules are used in a wide range of applications and devices in industrial automation, medical technology, robotics, telecommunications and many other verticals. Backed by controlling shareholder DBAG Fund VIII, a German midmarket fund focusing on growing industrial businesses, congatec has the financing and M&A experience to take advantage of these expanding market opportunities. congatec is the global market leader in the computer-on-modules segment with an excellent customer base from start-ups to international blue chip companies. More information is available on our website at www.congatec.com or via LinkedIn, X (Twitter) and YouTube.

By Jessica Isquith, President, PICMG

The end of every calendar year provides an opportunity to reflect on our achievements and shortcomings. But as 2023 draws to a close, I’m nothing short of astonished with what our membership has accomplished.

Seven specifications have reached significant milestones this year alone:

1. COM-HPC 1.2. The latest and most advanced COM on the market was upgraded (to a smaller size) with the release of the COM-HPC 1.2 spec revision. Dubbed COM-HPC “Mini”, the 95 mm x 60 mm platform loses a connector compared to its fellow COM-HPC form factors, but still delivers 400 pins for carrying high-speed signals from the processor module to carrier boards.
2. COM Express 3.1. The established leader in the computer-on-module (COM) market upgraded interfaces to provide increased speed and bandwidth over the previous generation. This will keep the specification compatible with leading-edge processor technologies.
3. MicroTCA R3.0. MicroTCA continues its 15-year evolution, as Revision 3.0 of the specification add 100 GbE and PCIe Gen 5 interfaces to cement the open platform in high-energy physics and scientific research, communications, and medical applications for years to come. MicroTCA is also a favorite of Quantum Computing startups, many of whom have already adopted the standard in their R&D efforts.
4. ModBlox7. The first open standard Box PC, ModBlox7, is in its final review phase and expected to be ratified by Q1 2024. It’s modularity, flexibility, and scalability is poised to address the demands of today’s industrial and transportation use cases.
5. IoT Specs. PICMG’s IoT specification efforts continue to expand as work with Redfish APIs was formally adopted by the DMTF. With continued effort and adoption, the IoT.x family of specifications will enable sensor-to-controller-and-beyond data transparency that will drive the need for and application of compute intelligence at the edge.
6. CompactPCI Serial Extension. CompactPCI, one of the original PICMG specifications, lives on in the form of CompactPCI Serial. A specification extension adds PCI Express Gen 4, 100 GbE, and support for other modern serial signals. The upgraded performance will allow CompactPCI Serial Extensions to keep targeting industry and transportation platforms where it has been successful for decades.
7. InterEdge. InterEdge defines a set of specifications for process and automation control for the rugged far edge. This effort is a collaboration between PICMG and OPAF of the OpenGroup and backed by leaders in the energy and industrial markets. It is scheduled for release in early Q1.

All these accomplishments set PICMG up for an exciting 2024, which also happens to be the consortiums 30^th anniversary of developing open embedded computing standards. With multiple new specifications primed to enter the industry, we’re looking forward to keeping up the momentum we’ve built over the last calendar year thanks to the hard work and determination of our member companies.

In addition to thanking existing members for their consistent contributions, we invite non-member companies to become part of the specification development process by joining and participating in PICMG. Through collaboration, significant problems are being solved that are reshaping multiple industries with open, interoperable solutions that enable thousands of embedded solutions to reach the market in an efficient and timely fashion.