Industry News

February 24, 2021

Official Ratification of COM-HPC Specification

Industry NewsNewsPICMG

The open specification for high performance compute modules is approved by the PICMG Consortium

Wakefield, MA., 2021 – PICMG, a leading consortium for the development of open embedded computing specifications, announces that COM-HPC has been approved and ratified, and is now available for public download and distribution.

“Twenty-six industry-leading companies worked together diligently and cohesively over a span of five years”, said Christian Eder, the COM-HPC Working Group Chair. “I owe a big thank you to the team for the dedication and excellence they all brought to the effort. It is a clear proof of the importance of the COM-HPC specification. Now we are well prepared to address current and future technology requirements.”

COM-HPC defines five module sizes to deliver edge server performance for small, rugged data centers. The specification addresses emerging requirements in the embedded and edge computing market. The base specification will be accompanied later this year by a Platform Management Interface Specification, COM-HPC EEEP, and a Carrier Board Design Guide.

“The PICMG organization is proud of the extraordinary collaboration between industry leaders that has led to the completion of the COM-HPC base specification, said Jess Isquith, president of PICMG. “The new open standard will enable multiple AI and Industry 4.0 applications, amongst others, to be realized by bringing server-level computing to the edge. Adopting the specification provides a necessary standard to reduce time to market and stabilize costs for hundreds of solutions providers.”

It is important to note that the specification covers two classes of modules.

The COM-HPC Client Module Type targets use in high end embedded client products that need one or more displays, a full set of low, medium, and extremely high bandwidth I/O, powerful CPUs and modest size. Typical uses are in medical equipment, high end instrumentation, industrial equipment, casino gaming equipment, ruggedized field PCs, transportation and defense systems and much more.
The COM-HPC Server Type targets use in high end headless (no display) embedded servers that require intensive CPU capability, large memory capacity, and lots of high bandwidth I/O including multiple 10Gbps or 25Gbps Ethernet, and up to 65 PCIe lanes, at up to PCIe Gen 5 speeds. Typical uses are in embedded server equipment ruggedized for use in field environments and applications such as autonomous vehicles, cell tower base stations, geophysical field equipment, medical equipment, defense systems and much more. Both client and server modules have a dedicated platform management interface which is the first for a COM standard to include remote administration.

This new specification does not replace COM Express, which will continue to play a crucial role in the COM marketplace for many years.

The specification documents are available for download on the PICMG website at picmg.org/open standards/com-hpc/. Also available is a preview document and additional resources to learn more about the specification.

TECHNICAL HIGHLIGHTS:

  • Two 400-pin BGA mount high-performance connectors
  • Platform Management Interface
  • Not limited to x86 processors
  • Provides for the use of x86 & RISC processors, FPGAs and GPGPUs
  • COM-HPC Client Modules
    • Up to 48 + 1 PCI Express Gen4/5 lanes
    • Up to 4x USB4
    • Up to 4x video interfaces
    • Up to 2x 25 Gb Ethernet interfaces
    • Module sizes:
      • Size A: 95 x 120 mm
      • Size B: 120 x 120 mm
      • Size C: 160 x 120 mm
  • COM-HPC Server Modules
    • Up to 64 + 1 PCI Express Gen4/5 lanes
    • Up to 2x USB4
    • Up to 4 graphic interfaces / headless
    • Up to 8x 25 Gb Ethernet interfaces
    • Module sizes:
      • Size D: 160 x 160 mm
      • Size E: 200 x 160 mm

Members of the PICMG COM-HPC committee include: University of Bielefeld, Acromag, ADLINK, Advantech, Amphenol, AMI, Avnet Integrated (MSC Technologies), Comtel, Duagon (MEN Mikro Elektronik), congatec, Elma Electronic, ept, Eurotech, Fastwel, GE Automation, HEITEC, ICC Intelligent Platforms, Intel, Kontron, N.A.T., nVent, Samtec, SECO, Supermicro, TE Connectivity, Trenz Electronic, and VersaLogic. ADLINK, congatec and Kontron are the committee sponsors. Christian Eder, marketing director of congatec, is the chairman of the COM-HPC committee. He was previously a draft editor of the current COM Express standard. Stefan Milnor from Kontron and Dylan Lang from Samtec support Christian Eder in their respective functions as editor and secretary of the PICMG COM-HPC committee.

May 3, 2017

VadaTech launches new Virtex UltraScaleTM FPGA Carrier

Industry NewsNews

Henderson, NV – December 16, 2016 – VadaTech, a leading manufacturer of integrated systems, embedded boards, enabling software and application-ready platforms, announces the AMC596, an FPGA module based on the Virtex UltraScale™ XCVU440 FPGA.  This is the largest of the UltraScale™ FPGAs, here supported by 8GB of 64-bit wide DDR4 and an on board Power PC P2040.  The additional connectivity provided by PinoutPlusTM, over 250 Gbps between neighboring modules, makes the product ideal for ASIC emulation and demanding sensor processing applications.

The AMC596 extends a rich product line of Virtex-7 and UltraScale™ products covering PCIe edge, VPX and AMC form factors.  With common architecture and supporting VHDL, users can easily port applications from one form factor to another to meet different environmental and market requirements.

About VadaTech

VadaTech provides innovative embedded computing solutions from board-level products, chassis-level platforms, to configurable application-ready systems. With a focus on AdvancedTCA, MicroTCA, VPX and PCIe solutions, the company offers unmatched product selection and expertise. A unique combination of electrical, mechanical, software, and system-level expertise, enables VadaTech to provide customized commercial or rugged computing solutions to meet the most complex customer requirements. VadaTech also offers specialized product solutions for VME, CompactPCI, and other architectures. A member of PICMG and VITA, VadaTech has headquarters, design and manufacturing facilities in Henderson, NV with design, support and sales offices in Europe and Asia Pacific 

VadaTech, Inc.  www.vadatech.com 

198 N. Gibson Henderson, NV 89014

Company Contact:  Ian Shearer   702-896-3337  [email protected]

VadaTech, Inc.  www.vadatech.com

 

January 12, 2016

New PICMG Sub-committee to Propel CompactPCI Serial into Space Applications

Industry NewsNews

Members sought to help define requirements and expand technology platform

Wakefield, MA,– PICMG, a leading standards organization for embedded computing applications, is forming a new working group to extend CompactPCI Serial technology to space applications. CompactPCI Serial is a fairly new platform that adds fast serial interfaces and integral networking to CompactPCI, dramatically increasingly its performance and speed.

The sub-committee is currently seeking additional companies to help plan and develop the new Space CompactPCI Serial standard.  Interested parties are invited to contact PICMG ([email protected]).

Manfred Schmitz, CEO of MEN Mikro Elektronik GmbH, who is organizing the subcommittee, noted, “CompactPCI itself has been a trusted platform in space for several decades.  This new sub-committee will identify the specific factors needed to ensure the simple and successful use of CompactPCI Serial in space applications today and into tomorrow.” MEN Mikro Elektronik GmbH is the parent company of MEN Micro Inc., the North American subsidiary.

The new working group, Space CompactPCI Serial will also include PICMG member companies and well-known industry leaders, such as Airbus Defense & Space, Thales Alenia Space, and STI Spacetech.

Specific application needs within the space environment will be the focus of the new group. Topics currently identified include environmental factors, fault detection and provisions for high availability as well as the need for serial interfaces such as SpaceWire and Rapid I/O for board-to-board communication.

Joe Pavlat, president of PICMG, notes, “Extending CompactPCI Serial into space applications is the next step in the development of this time-proven family of standards. The CompactPCI Serial base specification has the mechanical and conduction cooling technologies needed for space already defined and in place. Both 3U and 6U Eurocard formats are supported.”

As with the initial development of the CompactPCI Serial standard, one of the major goals is to keep the technology straightforward, understandable, and to guarantee maximum interoperability between bus slots and boards.

With Space CompactPCI Serial, designers can implement leading edge technical solutions for this highly specialized market while reusing and evolving proven technology. This will provide increased flexibility and significant cost reductions when compared to custom, single vendor solutions for space.

CompactPCI technology has a long standing history in space applications, from the famous “Curiosity” Mars Rover and satellite control to performing scientific tasks on the International Space Station.   A typical application envisioned for Space CompactPCI Serial is the implementation of the platform and the payload controller onboard satellites.

  • Space CompactPCI Serial Working Group
  • Committee members sought for insights, contributions and developments
  • Charter for the working group includes the addition of space-related serial interconnects as well as the inclusion of high availability, fault detection, and environmental requirements unique to applications in outer space
  • Latest extension of PICMG’s CompactPCI family of standards
  • Will build on CompactPCI’s long standing history in space applications

For additional information on CompactPCI Serial visit CompactPCI Serial