March 10, 2026
PICMG Releases COM-HPC 1.3 Specification, Accelerating High-Performance Computing
COM-HPCCOMsIndustry NewsNewsOpen Standards
- New standard boosts performance, design flexibility, efficiency, and ecosystem expansion
Wakefield, Mass. – March 10, 2026 – PICMG, a leading consortium for modular open standards in embedded computing, today released the COM-HPC® revision 1.3 specification. The 1.3 revision further advances the high-performance Computer-on-Module (COM) standard to address evolving requirements in edge computing, industrial automation, medical technology, and high-performance applications.
The new enhancements position COM-HPC as a future-ready standard for memory-centric and accelerator-based architectures, advancing new designs in embedded computing technology.
Technical Advancements for High-Performance Embedded Computing
- Support for PCI Express Gen 6 and CXL: A key enhancement of revision 1.3 is support for PCI Express (PCIe) Gen 6, including additional signal budget definitions to meet increasing demands for data throughput and signal integrity. The specification also adds support for Compute Express Link (CXL), enabling high-bandwidth, coherent connectivity for memory and accelerator resources over the PCIe interface.
- Ecosystem Expansion: Mechanical updates further strengthen the ecosystem. New connector options — including non-BGA column-type variants — as well as additional approved connector suppliers such as Samtec, Amphenol, Hirose, and All Best, enhance supply chain flexibility and availability.
- Expanded Functionality: The revision adds support for C-PHY on MIPI-CSI, particularly relevant for camera and vision applications. An additional clock input supports the connection of 2×2 camera configurations for D-PHY.
- Improved Energy Efficiency: A new key feature is the introduction of Modern Standby (S0ix), which enables COM-HPC modules to better support energy-efficient operating modes. Bidirectional PCIe clock request signals support more efficient power management, and clock inputs support configuration as clock outputs. These enhancements simplify system design and improve signal routing in complex implementations.
- I/O Expansion: Revision 1.3 refines the use of GPIOs, which can now be preferentially assigned, for example, to monitor system states or control external devices. The new revision further defines an additional I2S interface, significantly enhancing audio capabilities. Moreover, the DC input range has been expanded to enable new electrical design options, including server-class applications. Optionally, the SMBus can now be used as an additional I2C interface.
Industry Voices
“Our support of the COM-HPC revision 1.3 is the next step in our ongoing commitment to continuous improvement,” said Christian Eder, director market intelligence at congatec and chairman of the PICMG COM-HPC working group. “Revision 1.3 expands vital functionality while fully preserving backward-compatibility, and that’s important for customers who want to upgrade systems, even if they are already in the field.”
“COM-HPC 1.3 is the result of close collaboration across the embedded ecosystem,” said Matthew Burns, director of technical marketing at Samtec and secretary of the COM-HPC working group. “The expertise of our signal integrity specialists proved instrumental in integrating PCIe 6.0 design guidelines into the specification.”
“COM-HPC 1.3 demonstrates how open standards can accelerate innovation,” said Joel Finkel, editor of the COM-HPC working group. “Its combination of new connectivity, higher performance, and greater design flexibility make this standard especially attractive for next-generation high-performance platforms.”
Meet PICMG at embedded world Nuremberg 2026:
PICMG executive officers and member companies invite attendees to the PICMG Booth 3-264 during exhibition hours: March 10-11 from 9:00 a.m.-6:00 p.m., March 12 from 9:00 a.m.-5:00 p.m.
PICMG will also host a networking reception and panel sessions on Wednesday, March 11 at 13:00 UTC in the Mitte entrance that covers the latest innovations in COM-HPC 1.3. Attendance is by invitation only. Contact marketing officer, Brandon Lewis, at [email protected] for more information.
About PICMG
Founded in 1994, PICMG is a not-for-profit 501(c) consortium of companies and organizations that collaboratively develop open standards for high-performance industrial, industrial IoT, military & aerospace, telecommunications, test & measurement, medical, and general-purpose embedded computing applications. There are more than 150 member companies that specialize in a wide range of technical disciplines, including mechanical and thermal design, single-board computer design, high-speed signaling design and analysis, networking expertise, backplane and packaging design, power management, high-availability software, and comprehensive system management.
Key standards families developed by PICMG include COM-HPC, COM Express, CompactPCI, AdvancedTCA, MicroTCA, AdvancedMC, CompactPCI Serial, InterEdge, ModBlox7, SHB Express, MicroSAM, and HPM (Hardware Platform Management). For more information, visit https://www.picmg.org, or follow PICMG on LinkedIn and X (formerly Twitter).
Media Contacts:
PICMG
Jessica Isquith
[email protected]
ThroughPut Marketing
Coline Pourtier
[email protected]