July 9, 2018
Arezzo, Italy, April 3, 2018
SECO is proud to present its latest product based on the brand-new Intel® 8th generation Core™/Xeon® CPUs, unveiled just today, April 3rd, 2018, by Intel®: COMe-C08-BT6. The launch is taking place at the same time with the launch of Intel® 8th generation Core™/Xeon®, since SECO is part of the early access program.
COMe-C08-BT6, a COM Express™ 3.0 Basic Type 6 Module, is an extraordinary platform as regards performance: with up to six cores – not to mention the Intel® Hyper-Threading Technology, that adds 12 virtual cores on top of that – this module can handle anything you throw at it.
Speaking of the CPU, COMe-C08-BT6 enables the Intel® 8th Generation Core™ i7/i5/Xeon® Processors (formerly Coffee Lake H), reaching up to 12 threads.
As far as graphics are concerned, the module is equally impressive, mounting the Intel® Gen9 LP graphic core architecture that can manage up to 3 independent displays at once, with a resolution up to 4096 x 2304 @60Hz, 24bpp. Frameworks for high-end graphics and multimedia, such as DirectX 12 and OpenGL 4.5, are supported, as well as hardware acceleration. Finally, the module also embeds an H.265 / HEVC hardware transcoder – a characteristic that, combined with the outstanding performance and the compatibility with multiple video interfaces, makes it an ideal platform for projects operating in the field of gaming, digital signage, infotainment, and HMI.
When it comes to USB ports the module is also well-equipped, with 4x USB 3.1 Gen. 2 host ports and 8x USB 2.0 host ports. In terms of memory, the board features a couple of DDR4 SO-DIMM Slots for up to 32 GB with ECC technology, up to 2666 MHz. Concerning operating systems, the module can smoothly run Microsoft® Windows 10 64-bit, and Linux 64-bit. Additional application scenarios include biomedical devices, Industry 4.0, automation and telco.
“We are very proud to participate in the launch of the latest Intel® 8th generation Core™/Xeon® platform, by announcing our new COM Express™ 3.0 Basic Type 6 Module COMe-C08-BT6”, states Giacomo Giorgi, SECO R&D Manager, x86 dept. “Successful development and early access launch of this powerful solution was a great challenge. This new milestone in SECO’s roadmap, always at the forefront of innovation, was made possible by the long-standing collaborative partnership with Intel® and the excellent job and strong expertise of the whole SECO R&D team”.
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SECO is a world-leader in electronic embedded solutions. Spanning its 39+ years of experience, SECO has shown the ability to adapt its know-how to new and challenging customer needs and to provide cutting edge solutions to its partners. On the strength of its know-how and in contrast with recent outsourcing trends, SECO has always run the entire production cycle in Italy, from the development stage to mass distribution. Thanks to new, innovative solutions and superior research and design activities together with the partnership with a number of major scientific Universities and world-leading companies, SECO expanded on the international scene becoming a global market-leader and providing solutions to modern challenges.