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Advanced Mezzanine Card (AMC) with Freescale QorIQ® P204x

The NAMC-QorIQ-P204x is a multi-service quad-core CPU board featuring various Ethernet interfaces, PCIe Gen2 and SRIO connectivity. If equipped with a P2041 CPU it even offers a 10Gbit/s Ethernet interface.
It is equipped with both software-based processing resources in the form of the Freescale QorIQ P2041/2040 CPU and hardware-based resources featured by a Lattice ECP3-17 FPGA.
The board offers a low power and a low cost Power PC based multi-core computing platform with extension options for adaptation to the particular application needs.
Form factor for this board is the Advanced Mezzanine Card (AMC) standard, offering access to the flexible and powerful system standards ATCA and μTCA.

Form Factor
– AMC: mid or full size

CPU Core
Freescale QorIQ P2040 or P2041
– Packet processor featuring 4x e500mc PowerPC Cores @ up to 1.5 GHz
– 10x SerDes
– 128 kb/core L2 cache
– 10 GbE-Interface (XAUI, P2041 only) via backplane

FPGA
– Lattice ECP3-17
Memory
– 1024 – 4096 MB DDR3 DRAM – 64 bit wide, ECC as option
– 128 – 1024 MB NAND Flash memory
– 32 – 128 MB NOR Flash memory
– 512 kB MRAM
– Micro SD-Card Slot

Backplane Interfaces
– XAUI (P2041 only), SRIO and PCIe to AMC fat pipe region
– 2x Gigabit Ethernet to AMC Ports 0/1
– 2x SATA to AMC Ports 2/3

Front Panel Interfaces
– 2x Gigabit Ethernet via RJ45 or SFP (assembly option)
– USB
– RS232

NAMC-ADSP

Advanced Mezzanine Card (AMC) CPU Board with either 8 or 16 Blackfin DSPs

The NAMC-ADSP is a multi-purpose (tele-)communication resource board in AMC (Advanced Mezzanine Card) form factor, being equipped with either 8 or 16 Blackfin DSPs from Analog Devices.

The NAMC-ADSP is targeted at applications in communication environments with extensive need for voice or data computation. The module is designed to process standard telecom algorithms like voice and data compression and decompression or DTMF detection and generation. The NAMC-ADSP is suitable for any voice/data application in any signalling or VoP solution such as in ISDN, SS7, ATM, VoIP or 3G environments are suitable.

The module is capable of handling individual timeslots transmitted via I-TDM protocol over backplane Gigabit-Ethernet. The design is optimized for handling in parallel as many timeslots (TDM data) as possible. The TDM data streams are supplied by a standard I-TDM backplane interface located on port 0 and port 1 (redundant configuration) or port 8 of the AMC connector.

AMC-Interface
– NAMC-16ADSP: single-width, mid- or full-size AMC module
– directly connection of the local bus and the on-board devices to the backplane via PCIe-X1 lane

Backplane I-TDM Access
– TSI (Time Slot Interchanger) and TDM-to-I-TDM bridge are incorporated in a ECP2M50 FPGA from Lattice
– flexible routing and multi-casting of 64kbps timeslots between the various DSPs (TSI)
– conversion of TDM oriented bit stream into Ethernet packets and vice versa via TDM-to-iTDM bridge
– sending and receiving of ethernet packets via a 1000BaseT-BX Ethernet interface
Each DSP handles up to 256 bidirectional TDM channels.
– up to 4096 timeslots of 64kbps bandwidth

DSP Resources
– NAMC-ADSP-8: eight ADSP-BF535P Blackfin CPUs from Analog Devices
– NAMC-ADSP-16: sixteen ADSP-BF535P Blackfin CPUs
– 32MB individual SDRAM
– 1MB individual FLASH
– Blackfin DSP core frequency: 350MHz
– Blackfin DSP: 700 MMACs (max.) and 3.5MIPS per TDM channel

The NAMC-8569-E3/DS3 is an Advanced Mezzanine Card (AMC) with a powerful Freescale Power QUICC III MPC8569 processor providing access to DS3/E3 interfaces in next generation systems based on MTCA and ATCA standards. The TDM-to-ITDM converter connects the onboard DS3/E3 interface with a Gigabit Ethernet port for system interconnect (I-TDM).

The NAMC-8569-E3/DS3 is dedicated for (tele-)communication applications with extensive need for a high aggregation of DS3/E3 interfaces combined with access to switched networks based on high bandwidth Ethernet.

The chipset on the submodule consists of a line interface unit (LIU) from Maxim-Dallas (DS3251) that connects to a multiplexer/demultiplexer chip from PCM-Sierra (TEMUX84) to get access down to DS0 level.

The DS3/E3 framer interfaces to the on-board timeslot interchanger (TSI) chipset. The TSI as well as the TDM-to-ITDM bridge are incorporated in an ECP3 FPGA from Lattice. The TSI allows flexible routing as well as multi-casting of 64kbps timeslots between the various DS3/E3 streams. The TDM-to-ITDM bridge converts the TDM oriented bit stream into Ethernet packets and vice versa.

The MPC8569 offers a maximum TDM processing capability of 512 64kbps channels.

Access to just 8 or 16 E1/T1 lines can be provided by a derivate of the NAMC-8569-E3/DS3, the NAMC-8569-xE1.

System Processor and Memory
– powerful Freescale Power QUICC III MPC8569
– e500 PowerPC core combined with dedicated
– interface hardware and four RISC cores
– core frequency with up to 1.3GHz
– 128-1024 MB DDR2 SDRAM, 128 MB FLASH memory

E1/T1 Access
– on-board framer provides access to a DS3 – line at the front panel
– standard framing formats and
– T1 Super Frame (SF)
– T1 Extended Super Frame (ESF)
– T1 Digital Multiplexer (DM)
– T1 Switch Line Carrier -96 (SLC-96)
– E1 G.704 and G.706 (CRC-4 multiframe)

TDM and I-TDM Interface
– on-board timeslot interchanger (TSI) and TDM-to-ITDM bridge incorporated in an ECP3 – FPGA from Lattice
– flexible routing, multicasting of 64kbps timeslots
– optional 32MHz clocked H.110-alike TDM backplane interface on AMC connector(extended area).

Fabric Support
– Fat Pipe PCIe: one x1 (port 4 or 8) or one x4 (ports 4-7 or 8-11) or
SRIO: two x1 (port 4 and 8) or one x4 (port 4-7 or 8-11).
PCIe and SRIO: one x1 PCIe (port 4) and one SRIO (port 8).
– Base Fabric
Two 1000BaseX interfaces at port 0 and port 1 of the common options region of the AMC backplane connector.