May 12, 2021

congatec starter set for COM-HPC™ with 11th Gen Intel® Core™ processors

COM-HPC VideoVideo

congatec – a leading vendor of embedded and edge computing technology – presents a brand new COM-HPC™ starter set at embedded world 2021 DIGITAL. Optimized for modular system designs utilizing the latest high-speed interface technologies such as PCIe Gen4, USB 4.0 and up to ultra fast 2×25 GbE connectivity as well as integrated MIPI-CSI vision capabilities, the starter set is based on congatec’s PICMG COM-HPC Computer-on-Module conga-HPC/cTLU, which leverages 11th Gen Intel® Core™ processor technology (code name Tiger Lake). This new high-end embedded module generation targets system engineers working on the broadband connected edge devices that are emerging in industrial IoT. Target markets include medical, automation, transportation and autonomous mobility, as well as vision based inspection and video surveillance systems, to name just a few.

February 24, 2021

Samtec COM-HPC® Interconnects

COM-HPC VideoVideo

Samtec COM-HPC® Interconnects from Samtec on Vimeo.

The development of COM-HPC® exceeds the demand for high-speed performance in embedded computers, and provides scalability for next-gen embedded system designs. Samtec interconnects included in this standard offer 5 mm and 10 mm stack heights, a 400 pin open-pin-field on 0.635 mm pitch, BGA attach, and up to 112 Gbps PAM4 performance. Please watch the video to learn more.