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The XPedite5130 is a conduction- or air-cooled 3U CompactPCI (cPCI) single board computer based on the Freescale MPC8640D processor. With dual PowerPC e600 cores running at up to 1.25 GHz, the MPC8640D delivers enhanced performance and efficiency for today’s network information processing and other embedded computing applications.

Complementing processor performance, the XPedite5130 features two separate channels of up to 2 GB each of DDR2-533 ECC SDRAM, multiple PCI Express interfaces, PrPMC/XMC support, up to 256 MB of NOR flash (with redundancy), and up to 4 GB of NAND flash. Two Gigabit Ethernet ports, two RS-232/422/485 ports, and P14 I/O from the PrPMC are routed to J2 for additional system flexibility.

The XPedite5130 provides a high-performance, feature-rich solution for current and future generations of embedded applications. Operating system support packages for the XPedite5130 include Wind River VxWorks, Linux, QNX Neutrino, and Green Hills INTEGRITY.

The XPand5200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. This natural convection-cooled or conduction-cooled, fully-ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology. In today’s avionics and ruggedized environments, size really does matter, and the XPand5200 sets a new standard for sub-½ ATR computing.

Depending on your processing requirements, systems based on the XPand5200 Series can be populated with up to four high-performance, low-power 3U VPX or cPCI modules designed and manufactured by X-ES. X-ES also has an extensive lineup of PMC and XMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third-party modules.
Optional non-volatile SSD memory provides the convenience of high capacity storage and the ruggedness of solid-state memory. X-ES maximizes power supply performance, supporting an integrated MIL-STD-704 28 VDC power supply. Internal EMI filtering and holdup for up to 100 ms at 70 W is also provided.

Please contact X-ES sales to begin designing a system that will meet or exceed your I/O, processing, and power requirements.

The XPand4201 redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. This forced air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 F/G while integrating the latest power-saving and performance-enhancing technology. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by forced-air cooling. The XPand4201 sidewall heat exchangers have been increased by 1/2″ on each side to provide increased cooling capacity over the XPand4200. In today’s avionics and ruggedized environments, size really does matter, and the XPand4201 sets a new standard for sub-½ ATR computing.

An optional memory module bay can be added to the top of the XPand4201 unit, which supports a removable SATA solid-state disk (SSD) flash memory module.

An optional front-panel USB port provides system monitoring and maintenance capabilities. X-ES maximizes power supply performance, supporting up to 200 W from a MIL-STD-704 28V DC or 115V AC input, as well as internal EMI filtering and hold up for up to 60-ms at 200 W.

Depending on your processing requirements, the XPand4201 can be populated with high-performance, low-power, conduction-cooled 3U VPX or cPCI modules designed and manufactured by X-ES. X-ES also has an extensive lineup of conduction-cooled XMC and PMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third party modules.

Please contact X-ES sales to begin designing a system that will meet and exceed your I/O, processing, and power requirements.