The XPand4201 redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. This forced air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 F/G while integrating the latest power-saving and performance-enhancing technology. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by forced-air cooling. The XPand4201 sidewall heat exchangers have been increased by 1/2″ on each side to provide increased cooling capacity over the XPand4200. In today’s avionics and ruggedized environments, size really does matter, and the XPand4201 sets a new standard for sub-½ ATR computing.
An optional memory module bay can be added to the top of the XPand4201 unit, which supports a removable SATA solid-state disk (SSD) flash memory module.
An optional front-panel USB port provides system monitoring and maintenance capabilities. X-ES maximizes power supply performance, supporting up to 200 W from a MIL-STD-704 28V DC or 115V AC input, as well as internal EMI filtering and hold up for up to 60-ms at 200 W.
Depending on your processing requirements, the XPand4201 can be populated with high-performance, low-power, conduction-cooled 3U VPX or cPCI modules designed and manufactured by X-ES. X-ES also has an extensive lineup of conduction-cooled XMC and PMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third party modules.
Please contact X-ES sales to begin designing a system that will meet and exceed your I/O, processing, and power requirements.