Archives

ADLINK Express-RLP Key Features:
• 13th Gen Intel® Core™ Mobile Processor
• COM Express Rev. 3.1
• Up to 14 cores, 20 threads at 15W/28W/45W TDP
• Up to 64GB DDR5 SO-DIMM at 4800 MT/s, IBECC
• AI inferencing (AVX-512 VNNI, Intel® Iris® Xe)
• PCIe Gen4, 4x displays / 2x USB4
• Extreme rugged operating temperature (option)

ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.

The module provides support for PCIe 4.0 and DDR5 memory with up to 4800 MT/s, 4 display or USB4/TBT4 via DDI/LVDS, and features integrated Intel® Iris Xe graphics with up to 96EUs, allowing for instantaneous on-device AI performance.

Equipped with Intel® TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking) support, the Express-RLP ensures timely execution of deterministic, hard real-time workloads with ultra-low latency, making it well suited for mission-critical AIoT use cases, including industrial automation, AMR (Autonomous Mobile Robot), autonomous driving, medical imaging, video broadcasting, and more.

The Relio R3 is a solid-state 3U rackmount computer designed for industrial and commercial applications requiring high reliability, maximum I/O expansion, scalable processing, and a long product life cycle.

Building on the advantages of COM Express architecture, the R3 features an Intel Atom® N2800 1.8GHz dual-core processor with 4GB RAM. The system requires low power consumption while operating fanless over a wide operating temperature range of 0°C to 50°C. Standard features include dual Gigabit Ethernet, four SeaLATCH locking USB 2.0 ports, three serial ports, DisplayPort video, and audio interfaces. The system includes a 7” LCD touchscreen on the front panel for a convenient operator interface.

With a total of 18 SeaRAQ™ I/O expansion slots, the R3 offers unprecedented expansion capabilities supporting a variety of real-world analog I/O configurations such as A/D inputs, 4-20mA outputs, 0-20mA inputs, thermocouples, and RTD inputs. Optically isolated inputs, relay outputs, and additional serial interfaces are also available. The system offers one PCI Express slot compatible with any half-length PCIe x1 board.

The Relio R3 operates from your choice of 2.5″ SATA solid-state disk (SSD) that can be integrated and preloaded with Microsoft Windows or Linux 32-bit operating systems. Operating from solid-state disk, the system is perfect for industrial and commercial rackmount environments including process control, test & measurement, and HMI applications.

Extended temperature range and other options are available. If you have application-specific requirements, call today to discuss a Sealevel custom COM Express solution.

3U rackmount enclosure with powder-coated finish

Silent solid-state design with no fans or other moving parts

Eighteen expansion slots for optional analog, digital and serial I/O

Integrated 7” LCD touchscreen operator interface

Wide temperature operation from 0°C to 50°C ambient

COM Express Type 6 Module supports Intel dual-core Atom processors

Get your COM Express project off to a fast start with the Express-BASE6 COM Express carrier board. The Express-BASE6 supports Basic and Compact Type 6 COM Express modules. Standard features include seven PCI Express X1 slots, one PCI Express X16 slot, one PCI Express Mini slot, LPC-based Super I/O and dual BIOS support. The carrier board includes connectors for digital and analog video, USB, Ethernet, SATA, serial and audio interfaces. Specific features are COM Express module dependent.

The Express-BASE6 simplifies software development and prototyping while the target application carrier board is designed. Take advantage of Sealevel’s carrier board development services for the fastest time to market. Our extensive library of proven I/O circuits including serial, analog, and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application.

Features

COM Express Type 6 reference carrier board in standard ATX form factor

Supports Basic and Compact Type 6 COM Express modules that are compliant with PICMG COM Express Revision 2.0

Includes seven PCI Express X1 slots, one X16 slot, and one Mini PCI Express slot

Three Digital Display Interfaces (DDI) supporting DisplayPort, HDMI, and DVI displays

Integrated Realtek high definition audio codec

Integrated Winboard Super I/O on LPC bus

Integrated I2C to GPIO bridge for digital I/O

Onboard diagnostic LEDs for BIOS post code data and address on LPC bus

Onboard socket for secondary SPI flash BIOS

Two 220-pin COM Express Type 6 connectors

One DB15 for analog VGA display

One 34-pin header for LVDS

One 8-pin header for flat-panel control

Four SATA connectors (module dependent)

One Gigabit (10/100/1000BaseT) Ethernet RJ45 port

Up to Eight USB 2.0 ports (Up to four ports can be USB 3.0 if supported by module)

One DB9M serial port; one 10-pin header for serial interface

Six 3.5mm connectors for microphone/audio line-in and line-out

Two 6-pin mini-DIN connectors for keyboard and mouse

One 20-pin header for LPC bus debug

One 10-pin header for Smart Battery management communications

Additional connectors for SMBus, I2C, reset, power LED, HDD LED, buzzer and module control signals

ATX form factor works with standard ATX power supplies and enclosures