Archives

February 16, 2022

MSC C6B-ALP

The MSC C6B-ALP COM Express module features the 12th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance the module is ideal for compute intense applications in medical, transportation, video surveillance and gaming. The new Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). For applications with need for lower power dissipation, selected processor variants can be operated down to 12W TDP.

For highest data throughput the module enables fast DDR5-4800 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to sixty-four GB. I/O located on COM Express carrier designs can be connected to the module via eight PCIe lanes (mix of Gen 4/3) and an eight lane PEG port capable of PCIe Gen 4. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i225 network controller. System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

January 5, 2022

Express-ADP COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor

ADLINK Express-ADP Key Features:
• 12th Gen Intel® Core™ Processor
• Edge AI (VNNI, Intel® Iris® Xe graphics)
• DDR5 up to 4800 MT/s
• 16 PCIe Gen4 lanes
• USB4 / TBT4

ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.

The modules provide support for PCIe 4.0 and DDR5 memory with up to 4800 MT/s combined with increased cache, as well as security and manageability features, AI enablement to deliver intelligent workload optimization, enhanced graphics, AI, computer vision, and enhanced peripheral, connectivity, and fast memory access capabilities.

The integrated Intel® Iris® Xe graphics, with up to 96EUs, offers four concurrent 4K60 HDR displays and Intel® Deep Learning Boost to deliver superior AI performance. Using DDI, eDP 1.4b and USB4/TBT4, the four independent displays support Display Alternative mode, providing premium graphics features for superior content support, display and I/O virtualization.

September 14, 2021

TQMx110EB – 11th Gen. Intel Core and Intel Xeon W-11000E series (Tiger Lake-H)

A new level of CPU, GPU and System Performance
11th Generation Intel® Core™ and Intel® Xeon® W-11000E Processors (codename “Tiger Lake H“) simple to integrate with the TQMx110EB Computer on Module from TQ

The 11th generation Intel® Core™ and Intel® Xeon® W-11000E processors are based on the latest microarchitecture and are particularly energy-efficient thanks to the 10nm manufacturing process. Equipped with up to 8 cores / 16 threads, 24 MB cache and powerful Intel® Iris® Xe graphics (12th generation), TQ fully leverages the latest innovations in x86 PC technology and enables applications in the fields of medical technology, gaming, infotainment/entertainment, virtual reality, industrial automation, robotics and industrial IoT. Completely new possibilities also arise for image processing and artificial intelligence. We advise you from the idea to your complete electronic system – everything from a single source.