Archives

September 30, 2021

SRS-1201-BLUBRICK, Rugged Wall-Mount Box

The SRS-1201-BLUBRICK® is an embedded rugged system platform for a wide range of applications. The modular concept is based on CompactPCI® Serial, a well-established industrial standard for IEEE 100x160mm2 size CPU- and I/O-boards.

The SRS-1201-BLUBRICK® comprises a 3-slot backplane and a DC power supply suitable for either automotive and industrial or railway usage.

The SRS-1201-BLUBRICK® is available either as basic enclosure, equipped w. backplane and PSU, or turn-key ready configured with a CompactPCI® Serial CPU card and up to two I/O or SSD mass storage boards.

The rugged box of extruded aluminium is provided with a mounting plate and available either for conductive cooling, or equipped with one or two fans for forced airflow.

September 17, 2021

COM-HPC Ampere Altra COM-HPC Size E Server Type Module with 80 core Ampere® Altra® SoC

ADLINK COM-HPC Ampere Altra Key Features:
• Up to 80 Arm v8.2 64-bit cores, up to 2.8GHz at 175W TDP
• Neoverse N1 based architecture
• Arm SystemReady compliance, open source EDKII
• Dedicated IPMB and PCIe for remote management
• 64x PCIe Gen4 lanes

ADLINK’s COM-HPC Altra is the first 80-core COM-HPC Server Type module in the world. It is based on the Ampere® Altra® SoC based on the Arm Neoverse N1 architecture and offers up to 80 Arm v8.2 64-bit cores at 2.8GHz with only 175 Watt TDP. The excellent performance-per-watt architecture makes the COM-HPC Altra well suited to processing massive data at the edge without requiring a significant initial investment or ongoing maintenance costs.

The COM-HPC Altra is certified to comply with the Arm SystemReady program, ensuring it supports generic operating systems and subsequent layers of software, providing a seamless experience. Combined with the open source EDKII project, the module supports CentOS, Ubuntu and Yocto Linux operating systems.

Large dedicated memory caches and up to 768GB DDR4 system memory with 6 individual memory channels deliver predictable performance throughout the whole workload execution. Combined with a scalable processor from 32 to 80 cores allows the COM-HPC Altra to deliver reliable performance in many diverse applications.

Three PCIe x16 Gen4 lanes deliver a seamless accelerated heterogeneous architecture, ideal for autonomous driving, AI, robotic surgery, automatic drilling control & ship management. Dedicated IPMB and PCIe x1 lane connect to a remote management BMC as well as to a shelf manager on the carrier. The device can be easily monitored out-of-band.

September 15, 2021

TQMxE40M – Intel Atom x6000E series (Elkahrt Lake)

• 6th Generation Intel Atom® x6000 series (“Elkhart Lake“)
• Dual/Quad core computing power with up to 2.9 GHz
• Up to 16 GB LPDDR4/4x soldered with inband ECC (option)
• 1x Gbit Ethernet
• 2x USB 3.1 (Gen2) and 8x USB 2.0
• Up to 4 PCIe lanes (Gen3)
• Dual Display support with DP (4K) and eDP (4K) or LVDS (Single Channel)
• Up to 256 GB eMMC Flash, soldered
• Extended temperature support from -40°C to +85°C

The COM Express® Mini Module TQMxE40M is available with Intel® Atom™, Pentium® and Celeron® processors of the 6th generation (10 nm process technology) and impresses with increased CPU computing power, fast LPDDR4/4x memory up to 16 GByte, Inband ECC and significantly improved performance values in the area of graphics and image processing. Combined with the compact COM Express Mini design (84 mm x 55 mm) and the low power dissipation (4.5 – 12 Watt TDP), the module opens up new possibilities in industrial automation, measurement technology, aviation, medical technology and many other fields of application, especially in the extended temperature range from -40°C to +85°C. Two USB 3.1 Gen 2 ports (2x 10 Gbit/s) as well as four PCIe Gen 3 lanes (8 GT/s), offer a high bandwidth for extensions and additional functions on the carrier board.
Equipped with the latest Intel graphics processor, 4K screen resolution, impressive 3D video processing as well as significantly increased video encoding/decoding performance are provided. Virtualization and new functions such as Time Coordinated Computing offer the best conditions for real-time applications and time-synchronous IOT solutions. The optionally available eMMC flash memory (up to 256 GByte) and assembly options for either embedded DisplayPort (eDP) or LVDS offer great flexibility. The integrated board controller supports thermal management, a multi-stage watchdog, “Green ECO-Off” for minimum standby consumption and offers customer-specific configuration options (flexiCFG) for a high degree of flexibility. Combined with the optional paint finish and optimized cooling solutions, the TQMxE40M is also perfectly suited for rugged applications.