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The MSC C6C-ALP COM Express module features the 12th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. The module is ideal for applications such as in medical equipment, process control, HMI terminals, transportation, and intelligent kiosk, that require outstanding performance on a small form factor. The Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to twelve cores and sixteen threads at 28W thermal design power (TDP). For applications with need for lower power dissipation, selected processor variants can be operated down to 12W TDP.

For highest data throughput the module enables fast LPDDR5-5200 memory technology. Carried out as memory-down, the board can be assembled with up to thirty-two GB main memory. I/O located on COM Express carrier designs can be connected to the module via up to eight PCIe Gen 3 lanes and four lanes PCIe Gen 4. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i226 network controller. System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

The MSC HCA-ALP COM-HPC Client module features the 12th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance the module is ideal for compute intense applications in instrumentation, high-end medical equipment, transportation, video surveillance and gaming. The Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). Applications requiring lower power dissipation can be operated with selected processor variants at 12W TDP.

For highest data throughput the module enables fast DDR5-4800 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to sixty-four GB. I/O located on COM-HPC carrier designs can be connected to the module via up to eight PCIe Gen 3 lanes, up to eight PCIe Gen 4 lanes and an optional eight lane PEG port capable of PCIe Gen 4. The two Ethernet interfaces provide up to 2.5GbE bandwidth each based on the Intel i225/226 network controller. Further high-speed I/O can utilize USB ports featuring USB4 and USB 3.2. System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM-HPC standard enables performance scaling and migrating applications to future technology upgrades when they become available.

The COMh-sdID with scalability from 4 to 20 cores and SKUs for an extended temperature range and 24×7 / 10 years reliability allows very robust implementations for harsh environments and extreme conditions in a small mechanical footprint.

The module accommodates 4x DIMM sockets for a max. of 512GB DDR4 memory at 3200 MT/s. As storage medium, a soldered NVMe SSD onboard with up to 1 TByte storage capacity is optionally available.

With 48x PCIe lanes (32x PCIe Gen4 plus 16x PCIe Gen3 lanes) and 2x Quad LAN interfaces supporting 100Gb Ethernet, the COMh-sdID is an ideal platform for high data throughput requirements in demanding I/O and network structures.