Archives

August 29, 2018

6U CompactPCI Blade with 6th/7th Gen Intel® Xeon® E3 and Core™ i7/i3: cPCI-6636

‧ Supports 6th/7th Gen Intel® Xeon® E3 and Intel® Core™ i7/i3 processor
‧ Up to 32GB DDR4-2133 memory, soldered and SO-DIMM, optional ECC
‧ XMC support
‧ Up to 8x USB 3.0, 6x RS-232(TX/RX)
‧ Up to 4x GbE to rear I/O
‧ TPM2.0 and BIOS protection
‧ SEMA 3.5 support

The ADLINK cPCI-6636 Series is a 6U CompactPCI® processor blade based on the 6th/7th Generation Intel® Xeon® E3 and Intel® Core™ i7/i3 Processors with Intel® HM170 or CM236 Chipsets. The cPCI-6636 supports up to 16GB onboard DDR4-2133 memory and 16GB DDR4-2133 via SODIMM. Total memory capacity is up to 32GB of DDR4-2133. The cPCI-6636 is a highly integrated processor blade fit for mission critical applications in industries ranging from automation to defence.

The cPCI-6636 is positioned as the successor to ADLINK’s cPCI-6626 and cPCI-6525 in terms of I/O and feature set. The cPCI-6636 provides a 2.8x performance boost over the 2nd gen Core™ i7 (cPCI-6626) and 30% performance boost over 3rd gen Core™ i7 (cPCI-6525). Graphics features include 3 symmetric independent displays, 3D HW acceleration, DirectX 12, OpenGL 4.4, and H.265 HW decode/encode. The cPCI-6636 achieves 2.7x graphics score improvement over the 3rd gen Core™ i7 (cPCI-6525).

August 21, 2018

CPCIserial-CAN/402-2-FD

CompactPCI® Serial (PCIe®) Board with 2 CAN FD Interfaces

CompactPCI Serial Board with FPGA for 2x CAN FD via DSUB9 Connectors
– High-speed CAN FD interfaces acc. to ISO 11898-2, bit rate up to 8 Mbit/s
– Bus mastering and local data management by FPGA (esdACC)
– PICMG® CPCI-S.0 standard supporting high-speed PCI Express® interface lines
– Selectable CAN termination on the circuit board and cut-out in the front panel for jumper view
– Supports MSI (Message Signaled Interrupts)

Wide Range of OS Support and Advanced CAN Diagnostic
– Software drivers for Windows® and Linux® included free of charge
– Optional CAN layer 2 software drivers for real-time operating systems
– CANopen®, J1939 and ARINC 825 protocol libraries
– ISO 16845:2004 certified esd Advanced CAN Controller (esdACC) technology
– High resolution hardware timestamps

Advanced CAN Controller
– esd Advanced CAN Controller (esdACC) offers highest CAN performance and diagnostic

Customization on Request
– Ext. temperature range: -40° C … +75° C
– Error simulation support
– All signals via Rear I/O (P3)

July 12, 2018

Express-SL/SLE: COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)

Key Features
– 6th Gen Intel® Core™, Xeon® and Celeron® Processor with Intel QM170/HM170/CM236 Chipset (codename: Skylake)
– Up to 32GB dual channel ECC or non-ECC DDR4 at 2133 MHz
– 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays
– 8 PCIe x1 and 1 PCIe x16
– GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions
– Extreme Rugged operating temperature: -40°C to +85°C (build option for Core & Celeron 25W TDP SKUs)