Express-SL/SLE: COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)

Key Features
– 6th Gen Intel® Core™, Xeon® and Celeron® Processor with Intel QM170/HM170/CM236 Chipset (codename: Skylake)
– Up to 32GB dual channel ECC or non-ECC DDR4 at 2133 MHz
– 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays
– 8 PCIe x1 and 1 PCIe x16
– GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions
– Extreme Rugged operating temperature: -40°C to +85°C (build option for Core & Celeron 25W TDP SKUs)