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The CPU-163-15 is a rugged COM Express module designed to meet the requirements for industrial and rugged fanless applications.
Compliant with PICMG COM Express R2.1, Type 10, the CPU-163-15 is a 84x55mm (Mini) form factor module based on the Intel Atom E3800 processor family, with 1 to 4 cores, up to 4GB ECC RAM and up to 32GB eMMC.
With ECC soldered down memory and flash storage, the CPU-163-15 is the ideal hardware platform for applications requiring long life cycle, resistance to vibration and reliable data storage, even in extended temperature.
Supported operating systems include Windows 10 IoT Enterprise and Linux; moreover, the CPU-163-15 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/ OSGi middleware for IoT Edge Gateways.
Professional Services are available for the CPU-163-15, starting from BIOS personalization and including carrier board design, system development and production. Deep module customization, such as feature changes are also available.

FEATURES:
Powerful – Comes with Intel Atom E3800 CPU: one, two and four core configurations, up to 1.91GHz

Mini – Complies with PICMG COM Express R2.1, with a 84x55mm (Mini) form factor and a Type 10 pinout
Reliable – Offers memory configurations up to 4GB with ECC

Rugged – Supports wide operating temperature (-40 to +85°C), conformal coating options, soldered memory and flash storage

Low Power – Enables fanless designs with a CPU TDP starting from 5W

Professional Services – Cuts Time-To-Market with Eurotech Professional Services, which include deep module customization, BIOS personalization, carrier board and system design and production

IoT Native – Provides native support for IoT, including IoT middleware and access to Eurotech IoT Integration Platform

The CPU-161-18 is a COM Express module that combines a high performance and truly embedded CPU with an innovative hybrid RAM architecture that offers the ruggedness of soldered memory and the expandability of SO-DIMMs.
The standard configuration provides 8GB of memory soldered directly on the PCB and supports up to 24GB DDR4 RAM with ECC error correction through a SO-DIMM slot, targeting use cases where extreme ruggedness is required, and those that need a large memory.The CPU-161-18 can be configured with any member of the Xeon/Pentium D-1500 family; standard versions support extended temperature CPUs, such as the Pentium D-1519 and the Xeon D-1559, closing the gap between traditional embedded applications and servers.
Compatible with existing Type 6 carrier boards, the CPU-161-18 is a headless unit that provides a fast upgrade path to existing projects and that allows the creation of new high-performance ones: a notable feature of this Compact size module is the availability of a x16 PCIe Gen 3 port in addition to the x8 one, a characteristic that is more commonly found only on larger modules; other features include: Gigabit Ethernet, four SATA 3.0 ports, four USB 3.0 and seven USB 2.0 interfaces.
Supported operating systems include Yocto Linux and CentOS; moreover, the CPU-161-18 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT gateways.
Professional Services are available for the CPU-161-18, starting from BIOS personalization and including carrier board design, system development and production. Deep module customization, such as feature changes are also available.

FEATURES:
HPEC and Microserver Ready – Combines computational power with a rugged design to enable High Performance applications even in-the-field

Powerful – Supports the latest generation of embedded Intel Pentium and Xeon D-1500 CPUs to deliver a server-class module

Hybrid RAM Architecture – Innovates by offering the reliability of soldered-down RAM and the expandability of SO-DIMMs

Compact Size with PCIe x16 Port – Complies with COM Express Type 6 Rev 2.1, including support for a PCIe x16 port

Rugged and Fanless – Allows robust, fanless designs thanks to 100% soldered-down components and with a range of energy efficient CPUs

Customizable – Comes with optional personalization and full customization services, ranging from factory options to deep HW/SW configuration changes

– Carrier board for nanoX-BT and newer Type 10 modules
– 2x USB 3.0, 2x USB 2.0, and 1x USB client
– Supports DisplayPort and LVDS (eDP optional)
– 1x SD card slot
– 2x mini PCIe card slots (one supports mSATA)
– 2x LAN connectors
– Conforms to COM Express Carrier Design Guide rev. 2.0
– Supports Smart Battery and 19V adapter power supply