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CM22202 is a Type 6 COM Express® module developed by LinkedHope® based on China local x86 architecture ZX® KX-6000 series Processors. This module pinout is compliant with PICMG COM.0 R3.0 specification. CM22202 contains all kinds of high-speed interfaces such as SATA III, USB 3.0 and PCIe 3.0. CM22202 provides dual-channel SO-DIMM, supporting DDR4-2666 MHz memory and the capacity up to 32GB.
CM22202 supports KX-6000 series 4 core processors which TDP from 25W to 55W. CM22202 provides high performance computing with balanced power consumption. CM22202 works well in a wide range temperature environment. It is ideal for the high-bandwidth and processing intensive requirements of industrial and edge computing applications.
Target applications:
>> communication device
>> Intelligence analysis
>> Data Processing
>> Edge Computing

ADLINK cExpress-EL Key Features:

• In-Band ECC error correction
• 2.5GbE Ethernet, with optional TSN
• PCIe Gen3 lanes, USB 3.2 10Gbps
• 3x 4K display
• Real Time I/O (GPIO, UART, I2C)

ADLINK cExpress-EL supports 6th generation Intel Atom x6000 processors (Elkhart Lake) combined with Intel UHD graphics at low power envelope and high speed interfaces. cExpress-EL modules support In-Band ECC dual channel DDR4 memory up to 32GB, and are also available in rugged operating temperature range and low power envelope, making them a perfect match for mission critical fanless edge computing applications that require safety and reliability at all times.

The MSC C6C-TLU module is based on the 11th Gen Intel® Core™ processor generation (codename “Tiger Lake UP3”). Built on 10nm process technology the processor integrates the next generation Intel micro architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The board is ideal for mission critical applications, that require the durability of a well-designed board including memory-down, 24/7 continuous operation, extended temperature specification, shock and vibration product performance and optional conformal coating.

11th Gen Intel® Core™ processor
Quad and dual core variants
Power efficient processors, TDP 12 to 28W
Rugged module design
24/7 operation
Extended temperature variants
Optional conformal coating
Long-term product availability
Integrated Intel® Iris® Xe graphics, max. 96 execution units
Up to 32GB LPDDR4X memory, chip-down, dual-channel
In-band ECC option
Two SATA 6Gb/s mass storage interfaces
Three DisplayPort/HDMI interfaces
LVDS and Embedded DisplayPort interface
Up to four independent displays
DirectX 12, OpenGL 4.6, OpenCL 1.2/2.x driver support
Four USB 3.1 Gen1/2 and eight USB 2.0 interfaces
Two UARTs
Up to nine PCI Express™ Gen 3 lanes
One Gb Ethernet port
TSN, TCC support
UEFI Firmware
Trusted Platform Module TPM 2.0