The MSC C6C-TLU module is based on the 11th Gen Intel® Core™ processor generation (codename “Tiger Lake UP3”). Built on 10nm process technology the processor integrates the next generation Intel micro architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The board is ideal for mission critical applications, that require the durability of a well-designed board including memory-down, 24/7 continuous operation, extended temperature specification, shock and vibration product performance and optional conformal coating.
11th Gen Intel® Core™ processor
Quad and dual core variants
Power efficient processors, TDP 12 to 28W
Rugged module design
24/7 operation
Extended temperature variants
Optional conformal coating
Long-term product availability
Integrated Intel® Iris® Xe graphics, max. 96 execution units
Up to 32GB LPDDR4X memory, chip-down, dual-channel
In-band ECC option
Two SATA 6Gb/s mass storage interfaces
Three DisplayPort/HDMI interfaces
LVDS and Embedded DisplayPort interface
Up to four independent displays
DirectX 12, OpenGL 4.6, OpenCL 1.2/2.x driver support
Four USB 3.1 Gen1/2 and eight USB 2.0 interfaces
Two UARTs
Up to nine PCI Express™ Gen 3 lanes
One Gb Ethernet port
TSN, TCC support
UEFI Firmware
Trusted Platform Module TPM 2.0
