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December 17, 2020

COM-HPC® Taking Standardized COMs to the next level

EXECUTIVE SUMMARY

Enabling more powerful and sophisticated embedded servers and client devices for High Performance Computing (HPC) applications is a constant challenge for the embedded computing industry. In 2017 this led the PCI Industrial Computer Manufacturers Group (PICMG®) to introduce its COM Express® Type 7 standard. Kontron was fast to market with its first COMe Type 7 multicore processor embedded solutions, supporting powerful data analysis and real-time processing for edge server platforms.
However, the embedded computing industry must always be ready to anticipate and respond quickly to the challenges of future technologies and applications. These are being driven by the industrial internet of things (IIoT), some of which are already starting to make an impact: artificial intelligence, autonomous driving, and 5G wireless will create enormous data volumes and require unprecedented computing power and greater connectivity. At the same time, totally new design concepts for embedded computers are urgently required as existing standards will no longer be sufficient to cope.
In response to these growing high-performance computing requirements, a new working group was set up last year as part of the PICMG® standardization committee. This is to ensure the COM standard remains fit-for-purpose in the future. As a member of PICMG®, Kontron has been a driving influencer of the COM Express® standard since its inception. The company continues to be deeply involved in new developments, ensuring the standard’s continued
success and evolution. Therefore, Kontron is currently collaborating on a new highly specific High Performance Computing standard which will be complementary to COM Express® while taking the proven concept of standardized COMs to a whole new level.
This whitepaper considers the work that Kontron and other leading manufacturers are undertaking in order to deliver the new complementary COM Express® standard later this year: Computer-On-Modules High Performance Computing (COM-HPC®). In addition to reviewing the background to this initiative and highlighting the forthcoming standard’s key features, the future implications for COM Express® are also discussed.

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December 11, 2020

MSC C6B-CFLR

The MSC C6B-CFLR module is based on the 9th Generation Intel® Core™ Processor family. The Intel two-chip solution allows highest performance in graphics and computing on a COM Express module in basic form factor. The MSC C6B-CFLR offers triple independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory with optional error correction (ECC) and multiple USB 3.1/2.0 interfaces complete the compact and powerful module. With choices of six and quad-core processor options the board is well positioned to address challenging performance demands. Besides an extensive set of interfaces and features, the MSC C6B-CFLR offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort 1.4, DisplayPort 1.2, HDMI 1.4 and DVI as well as up to four USB 3.1 interfaces supporting the fastest peripherals currently available.

Intel® Core™ 9th Generation
Intel® Xeon®
E-2276ME (6C, 2.8/4.5GHz, 45/35W TDP/cTDP)
E-2276ML (6C, 2.0/4.2GHz, 25W TDP)
E-2254ME (4C, 2.6/3.8GHz, 45/35W TDP/cTDP)
E-2254ML (4C, 1.7/3.5GHz, 25W TDP)
Intel® Core™
i7-9850HE (6C, 2.7/4.4GHz, 45/35W TDP/cTDP)
i7-9850HL (6C, 1.9/4.1GHz, 25W TDP)
i3-9100HL (4C, 1.6/2.9GHz, 25W TDP)
Intel® Celeron®
G4930E (2C, 2.4GHz, 35W TDP)
G4932E (2C, 1.9GHz, 25W TDP)
Intel® UHD Graphics
Intel® chipsets QM370 or CM246
Up to 32GB DDR4-2666 SDRAM, dual channel, optional ECC
Four SATA 6Gb/s mass storage interfaces
Three DisplayPort/HDMI/DVI interfaces
Embedded DisplayPort / LVDS interface
Triple independent display support
DirectX 12, OpenGL 4.5, OpenCL 2.x
Resolution up to 4096 x 2304
Eight PCI Express™ x1 lanes, configurable up to x4, Intel® Rapid Storage Technology support
PEG configurable as 1×16 or 2×8 or 1×8 + 2×4
Four USB 3.1/2.0 and four USB 2.0 interfaces
Trusted Platform Module
UEFI Firmware

December 8, 2020

AM C8x/msd – AMC Processor

AM C8x/msd is an AdvancedMC® processor board based on the 6-core Intel® Xeon® E-2276ME processor with a 2.8GHz base frequency for high-performance applications.
Compared to previous product generations that had a fixed fabric interface, AM C8x/msd is available with either PCI Express® or RapidIO® fabric interfaces enabling the same processor complex to be used in a variety of user configurations.
By default, AM C8x/msd comes with 16 Gbytes soldered DDR4 Error Correcting Code DRAM with single bit error correction and dual channel architecture. Unique to AM C8x/msd, the standard 1000BASE-BX backplane connections can be used at 10GBASE-KR rates to significantly improve Ethernet throughput.