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NAMC-8569-ATM

Advanced Mezzanine Card (AMC) CPU Board featuring data exchange between
optical OC3/STM1 ATM traffic, Ethernet and TDM data

Flexibility, high-bandwidth and low latency processing dedicate the NAMC-8569-ATM for applications in telecommunication and defence communication market.

The front Ethernet interface can be switched or multiplexed towards the CPU and the backplane. Depending on the required throughput one Fat Pipe (PCIe or SRIO) or the combination of both Fat Pipes (PCIe and SRIO) are available to the backplane. Thus, the NAMC-8569-ATM is targeting at ATM based applications where IO boards need PCIe and where low latency of SRIO for multiprocessing is requested.

Latest Freescale PowerQUICC® III MPC8569 processor:
– dual Multichannel Communication Controller (MCC)
– higher core frequency than predecessor PowerQUICC III processors
– up to 1GB DDR2 SDRAM at 800MHz, 128MB flash

Lattice FPGA
– up to 70.000 logic cells

Interfaces at front panel
– 1x Gigabit Ethernet (GbE)
– 2x OC3 SFP

Backplane connections
– 2x Gigabit Ethernet (GbE)
– Serial Rapid IO (SRIO)
– PCI Express (PCIe)

TDM and I-TDM
– 125 μs and 1 ms I-TDM modes as well as TDM cross-connect supported

Z-PACK HM-Zd connectors are one of the hottest high-speed, differential, board to backplane electrical connectors to hit the telecommunications and computer industries. It’s an extension of the already established IEC 61076-4-101, Hard Metric connector family, however HM-Zd provides a differential solution for applications up to 12.5 Gb/s.

Tyco Electronics’ XAUI HM-Zd Interoperability Platform is a common platform for interoperability testing supported by members of the 10 GEA XAUI Interoperability Group and the 10 Gigabit Ethernet Consortium. HM-Zd has also been chosen as the backplane interconnect for the PICMG 3.x (ATCA) industry standard, driven toward dramatically improving and simplifying the routing of electronic interconnects.

The AdvancedTCA Guide Modules can be used in a wide variety of applications.For motherboard-to-daughtercard applications, the vertical pin and right angle socket can be used. This popular configuration is further supported by our wide offering of available keying positions. Each of the two keyed guide pins and guide sockets per module can be produced in a variety of different key
positions.

For co-planar applications, the right angle guide pins are used along with the right angle guide sockets. Both vertical and right angle guide pins are available in short or long sizes, to accommodate use with different Tyco Electronics connectors.