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The Elma Bustronic CompactPCI backplane series is designed to be fully compliant with PICMG standards. The EasyCable line features power nuts along the side of the backplane for easy and convenient cabling. We have provided all the standard features required for full compatibility, including all pin connections for bussed signal lines and all defined power and ground pins connected to their respective planes. User defined VI/O is standard. All of Elma Bustronic’s standard CPCI backplanes conform to the PICMG basic specification 2.0 R2.1 and Hot Swap specification 2.1 R1.0 They are designed to maximize performance, minimize noise, and give the customer the most reliable, cost-effective products possible. To achieve superior performance, we construct the board in eight layers (12 layers for H.110) — three signal layers, five power ground planes. We incorporate a full stripline design, generously distributed decoupling capacitors, and 2 oz. power and ground planes. Our standard design with two 2oz. copper ground planes fully shield the backplane, minimize EMI/RFI emissions susceptibility, minimize crosstalk, and maximize power distribution.
Two 2 oz. copper voltage planes allow us to maximize power distribution while they act as virtual ground planes for the signals in order to minimize noise and crosstalk. There is also a full VI/O plane. By exclusively utilizing stripline construction, we eliminate a significant source of EMI/RFI radiation and give all the signals similar characteristic impedances, virtually identical propagation delays, and minimal signal skew. All these items allow for significantly higher data transfer rates, as signal skew factors into the data transfer rate calculations four times.

FEATURES:
– Conforms to PICMG basic specification 2.0 R3.0
– PICMG Hot Swap specification 2.1 R1.0
– Versions conforming to PICMG H.110 Computer Telephony specification 2.5 R1.0
– 8-layer and 12-layer controlled impedance stripline design
– Superior power distribution
– Virtually zero crosstalk
– Logical slot #1 (system controller) is right justified

The Elma Bustronic CompactPCI backplane series is designed to be fully compliant with PICMG standards. The EasyPlug line features Positronic 47-pin power connectors on the backplane. The monolithic backplanes have pluggable modules that eliminate cabling in the chassis, reducing system costs and allowing more swappability. The 3U and 6U cPCI versions are standardly with the power connectors in a vertically oriented position. The 9U cPCI are standardly with the power connectors in a horizontally oriented position.
The new EasyPlug CompactPCI backplane line allows pluggability for power supplies, fan trays, utility headers, and shelf managers. This reduces mean-time-to-repair (MTTR) and time-consuming cabling costs. We have provided all the standard features required for full compatibility, including all pin connections for bussed signal lines and all defined power and ground pins connected to their respective planes. User defined VI/O is standard. All standard CPCI backplanes conform to the PICMG basic specification 2.0 R2.1 and Hot Swap specification 2.1 R1.0 All Bustronic backplanes are designed to maximize performance, minimize noise, and give the customer the most reliable, cost-effective products possible. To achieve superior performance, we construct the board in eight layers (12 layers for H.110) three signal layers, five power ground planes. We incorporate a full stripline design, generously distributed decoupling capacitors,and 2 oz. power and ground planes. Our standard design with two 2oz. copper ground planes fully shield the backplane, minimize EMI/RFI emissions susceptibility, minimize crosstalk, and maximize power distribution.

FEATURES:
– Conforms to PICMG basic specification 2.0 R3.0
– Conforms to PICMG Hot Swap specification 2.1 R1.0
– Versions conforming to PICMG H.110 Computer Telephony specification 2.5 R1.0
– Right or left justified system slot
– 47-pin Positronic power supply connectors – vertically mounted in 3U, 6U versions and horizontally mounted in 9U versions
– Virtually zero crosstalk

The Modular Test and Development platform solution is used in cPCI (3U and 6U) based Embedded computing applications. With a rugged modular aluminum construction, the versatile E-frame tower can support up to 19 slots at .8″ or 15 slots at 1″ pitch, depending on cabling options. There are front accessible test points and monitoring LEDs for +3.3V, +/-5V, +/-12V, +/- 24V, and +/- 48VDC. The E-frame features high performance cooling with 3 x 150 CFM fans under the card cage. The fans are speed controlled with fan fail indication. A system monitor with remote monitoring via Ethernet capability is optional.
The black coated powder coated finish of the E-frame enhances aesthetics and provides scratch-resistance. Other features include a Rear A/C PEM (Power Entry Module) with fuses, GND stud, front located ESD jacks. The unit also offers full RTM (rear transition module) support.

FEATURES:
– Versions supporting 3U or 6U cards
– Architecture includes CompactPCI
– Front accessible test points and monitoring LEDs for +3.3V, +/-5V, +/- 12V, +/- 24V, and +/- 48VDC
– High performance cooling via 3 x 150 CFM fans
– Speed controlled fans with fan-fail indication
– Optional system monitor with remote monitoring
– Full RTM support and rear A/C power entry module
– Pluggable front and rear module fan trays
– Top handle for ease of portability
– Attractive powder-coated finish is scratch-resistant