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The XPand4200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. This forced-air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 F/G while integrating the latest power-saving and performance-enhancing technology. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by forced-air cooling. In today’s avionics and ruggedized environments, size really does matter, and the XPand4200 Series sets a new standard for sub-½ ATR computing.

An optional memory module bay can be added to the top of the XPand4200 Series unit, which supports two removable SATA solid-state drive (SSD) flash memory modules. The XPand4200 Series removable SSD is capable of operating in the most stressful shock and vibration environments.

X-ES maximizes power supply performance, supporting up to 300 W from a MIL-STD-704 28 VDC input, as well as internal EMI filtering and optional holdup for up to 60 ms at 200 W.
Depending on your processing requirements, the XPand4200 Series can be populated with high-performance, low-power, conduction-cooled, 3U VPX or cPCI modules designed and manufactured by X-ES. An extensive lineup of conduction-cooled PMC and XMC solutions is available from X-ES to meet your data processing and I/O requirements. X-ES also provides integration services for third party modules.

Please contact X-ES sales to begin designing a system that will meet and exceed your I/O, processing, and power requirements.

The XPand3200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. XPand3200 Series systems are based on a conduction-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 while integrating the latest power-saving and performance-enhancing technology. In today’s avionics and ruggedized environments, size really does matter, and the XPand3200 sets a new standard for sub-½ ATR computing.

Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or cPCI modules designed and manufactured by X-ES. X-ES also has an extensive lineup of XMC and PMC solutions to fulfill your data-processing and I/O requirements. Additionally, X-ES provides integration services for third party modules.

An optional SATA SSD memory module provides the convenience of removable storage and the ruggedness of solid-state memory at up to 64 GB. An optional front-panel USB port provides system monitoring and maintenance capabilities. X-ES maximizes power supply performance, supporting up to 200 W from a MIL-STD-704 28 VDC or 115 VAC input. Internal EMI filtering and holdup for up to 60 ms at 200 W are also provided.

The XPand1201 is a low-cost, flexible, development platform. This platform supports up to ten 0.8 in. or 1.0 in. pitch conduction-cooled CompactPCI modules. It provides 482 W of total simultaneous power, which can be distributed as up to 16 A on 12 V, up to 40 A on 5 V, and up to 20 A on 3.3 V. The heat from the internal conduction-cooled modules is conducted to sidewall exchangers, where it is dissipated to the ambient environment by forced-air cooling. This efficient thermal design allows up to 60 W of power dissipation per slot at 30°C ambient, while maintaining 70°C at the module’s thermal interface.

X-ES platforms, including the XPand1201, provide a feature-rich solution for system development. RTMs provide maximum I/O flexibility and rapid system prototyping. Power and reset LEDs are provided for system status. A momentary push button is provided for reset, and a switch is provided for DC power enable.

The XPand1201 is available for purchase in several rapid-development, standard configurations. Custom configurations of modules, RTMs, and backplanes are also available utilizing X-ES and third party components.