The XPand4200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. This forced-air-cooled, fully ruggedized chassis is designed to meet the rigorous standards of MIL-STD-810 F/G while integrating the latest power-saving and performance-enhancing technology. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by forced-air cooling. In today’s avionics and ruggedized environments, size really does matter, and the XPand4200 Series sets a new standard for sub-½ ATR computing.
An optional memory module bay can be added to the top of the XPand4200 Series unit, which supports two removable SATA solid-state drive (SSD) flash memory modules. The XPand4200 Series removable SSD is capable of operating in the most stressful shock and vibration environments.
X-ES maximizes power supply performance, supporting up to 300 W from a MIL-STD-704 28 VDC input, as well as internal EMI filtering and optional holdup for up to 60 ms at 200 W.
Depending on your processing requirements, the XPand4200 Series can be populated with high-performance, low-power, conduction-cooled, 3U VPX or cPCI modules designed and manufactured by X-ES. An extensive lineup of conduction-cooled PMC and XMC solutions is available from X-ES to meet your data processing and I/O requirements. X-ES also provides integration services for third party modules.
Please contact X-ES sales to begin designing a system that will meet and exceed your I/O, processing, and power requirements.
