Archives

June 10, 2015

3U Compact PCI Intel Atom based CPU board CPC508

CPC508 is a PICMG 2.30 “CompactPCI Plus” compliant 3U module based on Intel® Atom N450 or D510 and ICH8M chipset. Due to the low power architecture of the Intel® Atom processor, the CPU card has a low power consumption and high performance. A specially outlined heat sink efficiently takes away the heat from the board, even at the extended temperature range.

CPC508 is designed especially for systems which require low power consumption, e.g. as a computing platform for rugged industrial PCs in mobile applications or for infotainment applications, offering the whole world of Windows® and Linux based software.

On the CPC508 module high-speed interfaces of input-output are applied (PCI-Express, Gigabit Ethernet, DVI) and modern technologies for operation with video are supported. Modular creation of a product allows system flexible set up for specific scopes, optimizing thereby the price/quality balance.

The PICMG 2.30 “CompactPCI Plus” compliance allows to use 32bit PCI bus together with intermodule communication for high-speed data exchange: two Gigabit Ethernet channels, four x1 PCI Express lanes, 4 USB channels, 2 SATA channels.

For extended system functionality the mezzanine module MIC589 with video/audio interfaces, CAN and serial ports is used. MIC589 can be connected to the processor CPC508 module from both sides left and right. One of the most important advantages of such expansion unit installation method is that it is possible to connect less cables to the processor CPC508 module or to avoid them absolutely. This can make the installation and dismantling of the CPU module from system easier.

Features:

-Intel Atom N450 or D510 CPU, soldered
-512MB or 1GB DDR2 SDRAM soldered
-VGA up to 2048×1536
-2 GbEthernet frontrear switchable
-PICMG2.30: PCI 32/33, PCIExpress 4×1, 2 SATA II, 4 USB
-CF and SD interfaces, 1 or 2 GB Flash SSD soldered
-Mezzanine 1: 2 USB, 2 RS232, 2 RS485 isolated,
-2 CAN 2.0 isolated, HD Audio, LVDS
-Mezzanine 2: 2 USB, 4 RS232, 2 RS485, PS/2, HD Audio

March 12, 2015

CP6003-RA/RC

CPCI/PICMG 2.16 Intel® Core i7 Second Generation System/Peripheral CPU Rugged Air, Rugged Conduction Cooled

Highest Quad / Dual Core Performance in 32nm Technology for Harsh Environments

The CP6003-RA/RC, a CompactPCI PICMG 2.16 compliant 6U CPU board, comes with various rugged levels, making it yet another addition to Kontron’s rugged PICMG 2.16 portfolio.
Based on the Intel® Core i7 second generation processor and the QM67 platform controller hub, the CP6003-RA/RC is featured by dual or quad core computing performance at a reasonable thermal design power, including a complete set of data, communication and multimedia interfaces.
The CP6003-RA version is designed for harsh application requirements in air-cooled environments, where the CP6003-RC is made for conduction cooled environments.
With the 2.1 GHz Intel® Core i7-2715QE and the LV 2.2 GHz Intel® Corei7-2655LE, the CP6003-RA/RC has extraordinary performance per watt values. Up to 16 GByte of soldered DDR3 1333 MHz memory with ECC provide the foundation of demanding software applications.
Based on the Intel® Mobile QM67 I/O controller hub the CP6003-RA/RC provides high graphics performance for VGA and two independent digital video outputs to the rear I/O as well as HDA audio capabilities.
Besides the outstanding graphics performance, the CP6003-RA/RC offers comprehensive I/O capability with up to 5x 1Gb Ethernet, 4 x rear I/O SATA with RAID 0/1/5/10 functionality, a local SATA Flash disk connector, as well as 6x USB 2.0, 2 x COM.
It can also accommodate a conduction cooled PMC/XMC slot for I/O intensive applications.
The board provides safety and security via an optional trusted platform module, (TPM 1.2), two redundant firmware hubs (failover) and IPMI support according PICMG 2.9 R1.0.

– 4HP, single slot quad or dual core CPU rugged air or conduction cooled
– Scalable processor speed, Intel® Core i7 up to 2.2 GHz
– Up to 16GB DDR3 1333 MHz soldered memory with ECC
– 5x GigEthernet Interfaces via PCIExpress
– Latest IO technology with SATA Gen 3, RAID, SSD
– XMC/PMC + SSD Flash configuration possible
– Rear I/O supporting PICMG 2.16