CP6003-RA/RC

Manufacturer

Kontron

Manufacturer's Product Page

CP6003-RA/RC

Datasheet

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Category

(cPCI) Boards - 6U Processors

CPCI/PICMG 2.16 Intel® Core i7 Second Generation System/Peripheral CPU Rugged Air, Rugged Conduction Cooled

Highest Quad / Dual Core Performance in 32nm Technology for Harsh Environments

The CP6003-RA/RC, a CompactPCI PICMG 2.16 compliant 6U CPU board, comes with various rugged levels, making it yet another addition to Kontron’s rugged PICMG 2.16 portfolio.
Based on the Intel® Core i7 second generation processor and the QM67 platform controller hub, the CP6003-RA/RC is featured by dual or quad core computing performance at a reasonable thermal design power, including a complete set of data, communication and multimedia interfaces.
The CP6003-RA version is designed for harsh application requirements in air-cooled environments, where the CP6003-RC is made for conduction cooled environments.
With the 2.1 GHz Intel® Core i7-2715QE and the LV 2.2 GHz Intel® Corei7-2655LE, the CP6003-RA/RC has extraordinary performance per watt values. Up to 16 GByte of soldered DDR3 1333 MHz memory with ECC provide the foundation of demanding software applications.
Based on the Intel® Mobile QM67 I/O controller hub the CP6003-RA/RC provides high graphics performance for VGA and two independent digital video outputs to the rear I/O as well as HDA audio capabilities.
Besides the outstanding graphics performance, the CP6003-RA/RC offers comprehensive I/O capability with up to 5x 1Gb Ethernet, 4 x rear I/O SATA with RAID 0/1/5/10 functionality, a local SATA Flash disk connector, as well as 6x USB 2.0, 2 x COM.
It can also accommodate a conduction cooled PMC/XMC slot for I/O intensive applications.
The board provides safety and security via an optional trusted platform module, (TPM 1.2), two redundant firmware hubs (failover) and IPMI support according PICMG 2.9 R1.0.

– 4HP, single slot quad or dual core CPU rugged air or conduction cooled
– Scalable processor speed, Intel® Core i7 up to 2.2 GHz
– Up to 16GB DDR3 1333 MHz soldered memory with ECC
– 5x GigEthernet Interfaces via PCIExpress
– Latest IO technology with SATA Gen 3, RAID, SSD
– XMC/PMC + SSD Flash configuration possible
– Rear I/O supporting PICMG 2.16