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The CPU-162-23 brings the computational performance and RAM capacity of a server to the field. It supports extended temperature range (-40 to +85°C) and ECC memory to operate reliably in industrial and rugged applications.

The CPU-162-23 can be configured with any member of the Xeon/Pentium D-1500 family, ranging from 4 to 16 cores and is available with up to four SO-DIMM sockets for a total of 64GB DDR4 with or without ECC.

The CPU-162-23 is a headless module with a Basic form factor (125x95mm) that is fully compliant with the COM Express Type 7 pinout, delivering very high speed interfaces, like up to x32 PCIe lanes, two 10Gbps (10GBASE-KR) and one 10/100/1000Mbps Ethernet port (1000BASE-T). Other interfaces include two SATA 3.0 ports, four USB 3.0 and four USB 2.0 ports.

Supported operating systems include Yocto Linux and CentOS; moreover, the CPU-162-23 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT Edge Gateways.

Professional Services are available for the CPU-162-23, starting from BIOS personalization and include carrier board design, system development and production. Deep module customization, such as feature changes are also available.

FEATURES:

HPEC and Microserver Ready – Combines up to 16 cores with a rugged design to enable High Performance applications even in the field

Powerful – Supports the latest generation of embedded Intel Pentium and Xeon D-1500 CPUs to deliver a server-class module

Up to 64GB ECC RAM – Supports up to four SO-DIMM sockets for ECC and non-ECC memory, to allow server-class applications

Two 10Gb Ethernet – Complies with COM Express Rev 3.0 Type 7, providing high speed interfaces such as two 10GbEthernet ports and up to x32 PCIe lanes

Rugged and Fanless – Operates from – 40 to +85°C, with error correcting code memory and low power variants for fanless design

Customizable – Comes with optional personalization and full customization services, ranging from factory options to deep HW/SW configuration changes

Professional Services – Provides the foundation for Eurotech Professional Services that span from carrier board development to complete system design, certification and manufacturing

Key Features
– Up to 16 cores Intel® Xeon D Series SoC (formerly codename: Broadwell-DE)
– Up to 32GB dual channel DDR4 at 1867/2133/2400MHz ECC (dependent on SoC SKU)
– Two 10G Ethernet and NC-SI support
– Up to eight PCIe x1 (Gen2), one PCIe x16 (Gen3)
– GbE, two SATA 6 Gb/s, four USB 3.0/2.0
– Supports Smart Embedded Management Agent (SEMA®) functions
– Extreme Rugged operating temperature: -40°C to +85°C (build option)

Key Features
– Intel Atom® Processor C3000 SoC (up to 16 cores), supports full virtualization (VT-d/VT-x)
– Up to 48GB ECC DDR4 memory at max. 2400MHz (and non-ECC supported)
– Up to 2x PCIe x8 Gen3 for flexible expansion
– Up to 4x 10GBASE-KR ports
– IEEE 1588 Precision Time Protocol (PTP) support for real-time applications
– Extreme Rugged operating temperature range: -40°C to +85°C (build option for eTEMP SKUs)
– Supports Smart Embedded Management Agent (SEMA) functions