Archives

July 5, 2019

SOM-5992

1. Intel® Xeon® Processor D-1500 Product Family
2. COM Express R3.0 Basic Module Type 7 pin out
3. 2~16 core processor, with max. TDP 45W
4. Dual-CH DDR4 2400 w/ECC, max. 128GB
5. High speed Ethernet (dual 10GBASE-KR interfaces, one GbE)
6. Abundant expansion. (PCIe x16, PCIe x8, 8 PCIe x1)
7. Supports iManager, Embedded Software APIs and Wise-PaaS/RMM

February 27, 2019

conga-B7E3

COM Express Basic Type 7 Server Class module based on AMD EPYC™ 3000 processor series

– AMD EPYC™ Embedded 3000 Series
– up to 16 Cores, 32MB Cache and 30..100W TDP
– 4x 10 Gigabit Ethernet KR Interface
– Up to 32 PCI Express generation 3 lanes
– Industrial grade variant
– Optional Onbard NVMe SSD up to 1 TB capacity

December 21, 2018

CPU-162-23

The CPU-162-23 brings the computational performance and RAM capacity of a server to the field. It supports extended temperature range (-40 to +85°C) and ECC memory to operate reliably in industrial and rugged applications.

The CPU-162-23 can be configured with any member of the Xeon/Pentium D-1500 family, ranging from 4 to 16 cores and is available with up to four SO-DIMM sockets for a total of 64GB DDR4 with or without ECC.

The CPU-162-23 is a headless module with a Basic form factor (125x95mm) that is fully compliant with the COM Express Type 7 pinout, delivering very high speed interfaces, like up to x32 PCIe lanes, two 10Gbps (10GBASE-KR) and one 10/100/1000Mbps Ethernet port (1000BASE-T). Other interfaces include two SATA 3.0 ports, four USB 3.0 and four USB 2.0 ports.

Supported operating systems include Yocto Linux and CentOS; moreover, the CPU-162-23 supports Everyware Software Framework (ESF), a commercial, enterprise-ready edition of Eclipse Kura, the open source Java/OSGi middleware for IoT Edge Gateways.

Professional Services are available for the CPU-162-23, starting from BIOS personalization and include carrier board design, system development and production. Deep module customization, such as feature changes are also available.

FEATURES:

HPEC and Microserver Ready – Combines up to 16 cores with a rugged design to enable High Performance applications even in the field

Powerful – Supports the latest generation of embedded Intel Pentium and Xeon D-1500 CPUs to deliver a server-class module

Up to 64GB ECC RAM – Supports up to four SO-DIMM sockets for ECC and non-ECC memory, to allow server-class applications

Two 10Gb Ethernet – Complies with COM Express Rev 3.0 Type 7, providing high speed interfaces such as two 10GbEthernet ports and up to x32 PCIe lanes

Rugged and Fanless – Operates from – 40 to +85°C, with error correcting code memory and low power variants for fanless design

Customizable – Comes with optional personalization and full customization services, ranging from factory options to deep HW/SW configuration changes

Professional Services – Provides the foundation for Eurotech Professional Services that span from carrier board development to complete system design, certification and manufacturing