Archives

– VGA and dual channel 18/24-bit LVDS
– Up to 8GB Dual Channel DDR3L at 1333MHz
– Single, dual, Quad-core Intel Atom® E3800 Series or Celeron® Processor SoC
– Two PCIe x1, and 32-bit PCI bus
– GbE, one SATA 3Gb/s, one PATA IDE, seven USB 2.0
– Supports Smart Embedded Management Agent (SEMA®) functions

The cExpress-BT2 is a COM Express COM.0 R2.1 Type 2 module supporting Intel Atom® processor E3800 Series and Intel® Celeron® N2930/J1900 processor SoC (codename: Bay Trail).

The cExpress-BT2 is specifically designed for customers who need high-level processing and graphics performance with low power consumption in a long product life solution.

The cExpress-BT2 features Intel Atom® processor E3800 and Intel® Celeron® N2930/J1900 processor supporting non-ECC type DDR3L dual-channel memory at 1066/1333 MHz to provide excellent overall performance. Integrated Intel® Gen7 HD Graphics includes features such as OpenGL 3.1, DirectX 11, OpenCL 1.1 and support for H.264, MPEG2, VC1, VP8 hardware decode. Graphics outputs include DDI ports supporting HDMI/DVI/DisplayPort and single-channel 18/24-bit LVDS (eDP is optional). The cExpress-BT2 is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The cExpress-BT2 has soldered type non-ECC DDR3L memory for up to 4 GB. In addition, onboard eMCC memory (8/16/32GB) and SDIO signals are optionally supported.

The cExpress-BT2 features a single onboard Gigabit Ethernet port, USB 3.0 ports and USB 2.0 ports, and SATA 3 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

– 5th Generation Intel® Core™ i7/i5/i3 and Celeron Processor System-on-Chip
– Up to 32GB Dual Channel DDR3L at 1600/1333 MHz
– Two DDI channels, one LVDS supporting 3 independent displays
– Dual channel 18/24-bit LVDS (or optional eDP)
– Four PCIe x1 or 1 PCIe x4
– GbE, four SATA 6 Gb/s, two USB 3.0, six USB 2.0
– Supports Smart Embedded Management Agent (SEMA®) functions
– Extreme Rugged operating temperature: -40°C to +85°C (optional)

The cExpress-BL is a COM ExpressR COM.0 R2.1 Type 6 Compact size module supporting the 64-bit 5th Generation Intel® Core™ i7/i5/i3 and ULT Processors and Intel® Celeron™ Processors with CPU, memory controller, graphics processor and I/O hub on the same chip. Leveraging the benefits provided by the Intel® Core™ i7/i5/3 ULT and Intel® Celeron™ System-on-Chip, the cExpress-BL is specifically designed for customers who need optimum processing and graphics performance with low power consumption in a long product life solution.

The cExpress-BL features the Intel® Core™ i7/i5/i3 processor and Intel® Celeron™ processor supporting Intel® Hyper-Threading Technology (up to 2 cores, 4 threads) and up to 32GB of non-ECC DDR3L dual-channel memory at 1333/1600 MHz in dual stacked SODIMM sockets to provide excellent overall performance.

Integrated Intel Generation 8 Graphics includes features such as OpenGL 4.2, DirectX 11.1, Intel® Clear Video HD Technology, Advanced Scheduler 2.0, 1.0, XPDM support, and DirectX Video Acceleration (DXVA) support for full AVC/VC1/MPEG2 hardware decode. Graphics outputs include dual-channel 18/24-bit LVDS (4lane eDP as option) and two DDI ports supporting HDMI / DVI / DisplayPort. The cExpress-BL is specifically designed for customers with high-performance processing graphics requirements who want to outsource the custom core logic of their systems for reduced development time.

The cExpress-BL features a single onboard Gigabit Ethernet port, two USB 3.0 ports and six USB 2.0 ports, and 4 SATA 6 Gb/s ports. Support is provided for SMBus and I2C. The module is equipped with SPI AMI EFI BIOS with CMOS backup, supporting embedded features such as remote console, CMOS backup, hardware monitor, and watchdog timer.

Key Features
– 6th Gen Intel® Core™, Xeon® and Celeron® Processor with Intel QM170/HM170/CM236 Chipset (codename: Skylake)
– Up to 32GB dual channel ECC or non-ECC DDR4 at 2133 MHz
– 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays
– 8 PCIe x1 and 1 PCIe x16
– GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions
– Extreme Rugged operating temperature: -40°C to +85°C (build option for Core & Celeron 25W TDP SKUs)