COM Express Type 6 Compact module based on 12th Gen Intel® Core™ embedded mobile processors (code name “Alder Lake”)
– Intel® hybrid design combines Performance-cores with Efficient–cores
– Up to Intel® Iris® XeGraphics® architecture with up to 96 EUs
– PCI Express Gen 4 | USB 3.2
– AI Acceleration with Intel® Deep Learning Boost (VNNI)
– Embedded Use Condition SKUs
ADLINK Express-ADP Key Features:
• 12th Gen Intel® Core™ Processor
• Edge AI (VNNI, Intel® Iris® Xe graphics)
• DDR5 up to 4800 MT/s
• 16 PCIe Gen4 lanes
• USB4 / TBT4
ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.
The modules provide support for PCIe 4.0 and DDR5 memory with up to 4800 MT/s combined with increased cache, as well as security and manageability features, AI enablement to deliver intelligent workload optimization, enhanced graphics, AI, computer vision, and enhanced peripheral, connectivity, and fast memory access capabilities.
The integrated Intel® Iris® Xe graphics, with up to 96EUs, offers four concurrent 4K60 HDR displays and Intel® Deep Learning Boost to deliver superior AI performance. Using DDI, eDP 1.4b and USB4/TBT4, the four independent displays support Display Alternative mode, providing premium graphics features for superior content support, display and I/O virtualization.
The HeiSys system platform combines the advantages of existing and established plug-on modules and offers full scalability of computing power on the one hand and on the other hand, multidimensional modularity in terms of communication and I/O interfaces.
Depending on the application and the requirements for computing power, datarate, signal diversity and power consumption, suitable COM Express boards can be selected.
Together with a self-developed FPGA SMARC module a large variance of interfaces can be mapped. This allows the realization of vehicle/field buses such
as MVB, Profibus, CAN and EtherCat.
A wide choice of wireless standards is supported via multiple M.2 connectors. The system platform is designed for the use of Wi-Fi, GSM, UMTS, LTE, 5G, LPWAN, LoRaWAN, Wi-Fi, Bluetooth and GPS/GLONASS multiband radio modules for industrial and railway operations.
This eliminates the need for complicated, time-consuming assembly or the timeconsuming coordination of various components.
The compact system is certified for mobile use as a rolling stock or for wayside monitoring by the approval according to EN 50155. Due to the absence of moving parts such as fans, the reliability and the MTBF is significantly increased. The system guarantees operation in an extended temperature range between -40 °C and +85 °C.
The system platform is excellently suited e.g. for the medical, energy / transportation, industrial and digitalization sectors. The system can be used as a gateway, a passenger information system, a wireless-access-point or as diagnostic and monitoring system in the energy sector or transportation. In marine, trains or automotive applications HeiSys can be used as a board computer or for navigation.
HeiSys supports Windows 10 / IoT and all Linux distributions of current kernels. The concept uses main line drivers or the drivers provided by the corresponding modules to ensure proper commissioning and function.
