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The MSC C6B-RLP COM Express module features the 13th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance the module is ideal for compute intense applications in industrial, medical, transportation, video surveillance and gaming. The Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP) and can go as low as 12W TDP. Selected variants of the processor provide TSN and Intel® TCC enabling extended real-time capabilities, allow continous running (24/7) and support module variants to operate in extended temperature range.

For highest data throughput the module enables fast DDR5-4800 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to sixty-four GB. I/O located on COM Express carrier designs can be connected to the module via eight PCIe lanes (mix of Gen 4/3) and an eight lane PEG port capable of PCIe Gen 4. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i226 network controller. System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

The MSC C6B-TLH COM Express module features the 11th Gen Intel® Core™ vPro®, Intel® Xeon® W-11000E Series, and Intel® Celeron® processors, giving application designers a great variety of choices of power efficient and performant compute solutions. CPU core count scales from two cores/two hyper threads up to eight cores/sixteen hyper threads. Processor variants with 25W and 45/35W thermal design power (TDP) are available. With eight PCIe Gen 3 lanes and a sixteen lane PEG port based on PCIe Gen 3 and 4, the module is well equipped to handle demanding I/O traffic. The Ethernet controller based on Intel i225 provides 1GbE and 2.5GbE bandwidth and offers TSN capability for real-time application. For further real-time support, TCC is enabled on boards equipped with the Intel® Xeon® W-11000E Series processor. Board memory capacities is configurable from 8GB to 64GB via two SO-DIMM sockets. Error correction code (ECC) is optionally supported by dedicated module variants and use of ECC SO-DIMMs. Selected variants of the MSC C6B-TLH can be operated at extended temperature range with full 24/7 utilization. This supports system designs exposed to harsh environmental conditions that require a reliable compute engine. System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

The MSC C6B-CFLH module is based on the 8th Generation Intel® Core™ Processor family. The Intel two-chip solution allows highest performance in graphics and computing on a COM Express module in basic form factor. The MSC C6B-CFLH offers triple independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory with optional error correction (ECC) and multiple USB 3.1/2.0 interfaces complete the compact and powerful module. With choices of six and quad-core processor options the board is well positioned to address challenging performance demands. Besides an extensive set of interfaces and features, the MSC C6B-CFLH offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort 1.4, DisplayPort 1.2, HDMI 1.4 and DVI as well as up to four USB 3.1 interfaces supporting the fastest peripherals currently available.

Intel® Core™ 8th Generation
Intel® Core™ i7-8850H (six-core, 2.6/4.3GHz, 45/35W cTDP),
Intel® Core™ i5-8400H (quad-core, 2.5/4.2GHz, 45/35W cTDP)
Intel® Core™ i3-8100H (quad-core, 3.0GHz, 45/35W cTDP)
Intel® Xeon® E-2176M (six-core, 2.7/4.4GHz, 45/35W cTDP),
Intel® UHD Graphics
Intel® chipsets QM370 or CM246
Up to 32GB DDR4-2666 SDRAM, dual channel (ECC optionally supported on models with Xeon E-2176M)
Four SATA 6Gb/s mass storage interfaces
Three DisplayPort/HDMI/DVI interfaces
Embedded DisplayPort / LVDS (24 Bit, dual channel) interface
Triple independent display support
DirectX 12, OpenGL 4.5, OpenCL 2.x
Resolution up to 4096 x 2304
Eight PCI Express™ x1 lanes, configurable up to x4, Intel® Rapid Storage Technology support
PEG configurable as 1×16 or 2×8 or 1×8 + 2×4
Four USB 3.1/2.0 and four USB 2.0 interfaces
Trusted Platform Module
UEFI Firmware