Archives

March 31, 2025

EmNano-iX701

EmNANO-iX701
Intel® Amston Lake (X7000 Series) Atom® Mini COM Express® Type 10 CPU Module

Features:

• Soldered onboard Intel Amston lake (X7000 Series) SoC Processor
• Soldered on board LPDDR5 SDRAM
• Intel 2.5 Gigabit Ethernet controller
• Single Channel 24-bit LVDS and 1 x DDI port
• Support Intel® Time Coordinated Computing (Intel® TCC)
for Intel®Edge Controls for Industrial

March 31, 2025

conga-TC750

COM Express Type 6 Compact module based on Intel® Core™ Ultra processors (code name “Arrow Lake”)

Cutting edge Intel® Arc™ Graphics with XMX Systolic Arrays and up to 128 EUs
Next level Edge AI performance up to 99 TOPS total
Up to 128 GB RAM with in-band ECC
Intel® performance hybrid architecture with up to 16 cores and 22 threads
PCI Express Gen 4 | USB 4

January 24, 2025

MSC C10M-EL

The MSC C10M-EL module is based on the Intel Atom® Processor x6000 Series (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor with graphics accelerators, memory controller and rich I/O functionality in a single package. The module is designed for extended temperature range and 24/7 operation in mission critical tasks that require a reliable and performant computing base. The COM Express Mini Module fits into space and thermally constraint system environments, while providing outstanding performance. Typical applications include industrial IoT, communication units, mobile medical equipment, way-side controllers and outdoor POS terminals.

The MSC C6C-EL can drive up to two independent displays with a maximum of 4k resolution. The COM Express Type 10 interface allows direct access to digital display interfaces including DisplayPort, HDMI and the choice of LVDS versus eDP. With a maximum capacity of 16GB fast LPDDR4x memory the board satisfies even demanding applications. Optional in-band ECC capabilities allow for protecting code and data kept in memory. High speed I/O includes four PCIe Gen 3 lanes and two USB 3.0 interfaces. Mass storage can be supported with the optional on-board eMMC memory and via two SATA channels.

System investments are well protected through long-term availability of the module, designed and manufactured by Avnet Embedded. The COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

CPU Intel Atom® x6425RE, quad-core / 4T, 1.9GHz, 32EU, IBECC, TCC, 12W, IUC
Intel Atom® x6414RE, quad-core / 4T, 1.5GHz, 16EU, IBECC, TCC, 9W, IUC
Intel Atom® x6212RE, dual-core / 2T, 1.2GHz, 16EU, IBECC, TCC, 6W, IUC
Intel Atom® x6425E, quad-core / 4T, 2.0/3.0GHz, 32EU, IBECC, 12W, EUC
Intel Atom® x6413E, quad-core / 4T, 1.5/3.0GHz, 16EU, IBECC, 9W, EUC
Intel Atom® x6211E, dual-core / 2T, 1.3/3.0GHz, 16EU, IBECC, 6W, EUC
Intel® Pentium® J6426, quad-core / 4T, 2.0/3.0GHz, 32EUs, 10W, PUC
Intel® Pentium® N6415, quad-core / 4T, 1.2/3.0GHz, 16EU, 6W, PUC
Intel® Celeron® J6413 quad-core / 4T, 1.8/3.0GHz, 16EU, 10W, PUC
Intel® Celeron® N6211 dual-core / 2T, 1.2/3.0GHz, 16EU, 6W, PUC

IUC – Intel Industrial Use Conditions
EUC – Intel Embedded Use Conditions
PUC – Intel PC Client Use Conditions