Archives

February 7, 2024

COMe 6C-TGL

A new Engicam COMe module, based on Intel® TIGER LAKE processors with the new Intel® Iris® Xe graphics. The platform offers up to 2.95 times higher graphics performance. The module combines a high-performance CPU, single-thread performance of up to 23%, and multi-thread up to 19% faster than the previous generation processors. Standard COM Express ® Mini type 10, suitable for IoT and real-time performance with an Ethernet interface of up to 2.5 Gb and DP/HDMI up to 4096×2160@60Hz.

December 20, 2023

Micro-ATX COM Express® Type 6 Evaluation Carrier Board

The ATX-M-CC462-T6 is a fully featured COM Express Type 6 carrier board designed to use industry-standard COM Express Type 6 modules including the WINSYSTEMS COMeT6-TGLU Series of COM Express Type 6 modules featuring the Intel® Tiger Lake UP3 SOC.

The ATX-M-CC462-T6 carrier implements the full capabilities of the Type 6 connectors and is compliant with PICMG® COM Express Rev 3.0 Specifications and has multiple interface options including 3x PCIe slots, multiple Video options, 4x SATA devices, 8x USB ports (2 and 3), and high speed 2.5Gbps Ethernet that make it highly configurable for use in any application.

This development/evaluation carrier board sully supports all connectivity of WINSYSTEMS’ COMeT6-1100 COM Express Type 6 Compact module and will support other PICMG-compliant COM Express Type 6 Compact modules.

The carrier board is designed to support a wide range of commercial, industrial, and automotive applications across a wide temperature spectrum (-40ºC to +85ºC).

INDUSTRIAL CARRIER BOARD
• Supports all interfaces on the WINSYSTEMS COMeT6 Modules
• Form Factor: Micro-ATX – 9.6 x 9.6 inches (243.84 x 243.84 mm)
• -40ºC to +85ºC with supporting cooling options
• Made in the USA
• ATX Mode: Standard ATX Power input
• AT Mode: 12VDC +/- 5%

DISPLAY AND GRAPHICS
• 3x DisplayPort++ Ports
• Support for Dual Channel LVDS and eDP,
including backlight

NETWORK
• 1x RJ45 supporting 2.5Gbps Ethernet from COMe

CONNECTIVITY AND I/O
• 4x USB 3.2 Gen1 (2x Front Panel Type A, 2x Header)
• 4x USB 2.0 (2x Front Panel, 2x Header)
• PCI Express Expansion
− 1x PCI Express Gen4 x16
− 2x PCI Express Gen3 x4
• Serial UART
− 2x RS 232 2pin (Tx/Rx) from COMe Module
− 2x RS232/422/485 Multiprotocol Legacy mode

STORAGE/SATA CHANNELS
• 4x SATA Type III (6Gbps) channels

SOFTWARE
• Windows 10, Linux

December 19, 2023

COM Express Type 6 Compact Module

The COMeT6-1100 is an industrial COM Express® Type 6 Compact module with an Intel® 11th Gen Intel Core™ i3/i5/i7 Processor.
This industrial module is designed and manufactured in the USA. The small form factor module is designed as a processor mezzanine
that can be plugged onto a carrier board containing user-specific I/O requirements.

COM Express modules allow users to retain the same carrier board design across scalable CPU series and over multiple generations
of COM Express modules providing a long project lifetime. Updating a COM Express module to improve performance or replace an
end-of-life processor drastically improves your time to market when revising existing projects. Users can choose the
default BIOS settings and layout, or request a custom-branded configurable BIOS to support specific project requirements.

INDUSTRIAL COM EXPRESS MODULE
• Form Factor: COM Express Type 6 Compact – 3.75 in x 3.75 in (95 mm x 95 mm)
• Made in the USA
• 11th Gen Intel Core i3/i5/i7 Processor, formally Tiger Lake-UP3
• -40°C to +85°C Operating Temperature Range
• Up to 32GB LPDDR4 4266 MT/s System Memory, supporting IBECC
• Standard 12 VDC Input, +/- 10%

SECURITY
• On-board Discrete TPM 2.0 Hardware Security
• vPro support on i5 and i7 CPUs Display and Graphics
• Intel Gen12 Graphics Engine, with up to 96 EUs
• Up to 4 simultaneous and independent displays
• 3x Digital Display Interface (DDI) to DisplayPort++ / HDMI / DVI
• 1x eDP (optional dual channel LVDS)
• 1x VGA (optional)

NETWORK
• 1x 2.5G Network via Intel i226 Controller
• TSN support

STORAGE
• 2x SATA III (6Gb/s) Interfaces to Carrier

CONNECTIVITY AND I/O
• PCIe Gen4 x4 for PEG or NVMe
• 5x PCIe Gen3 configurable as 4×1 (Default), 2×1 + 1×2, or 1×4
• 4x USB 3.2 Gen 1, 8x USB 2.0
• HD Audio
• 2x UART
• 4x GPI, 4x GPO

SOFTWARE
• Windows10, Ubuntu, Red Hat
• Custom configurable UEFI-based AMI BIOS
• System Management Libraries and Tools
• EAPI v1.1 support for System Info, WDT, I2C, Brightness, GPIO