Archives

September 28, 2020

MSC C6C-TLU

The MSC C6C-TLU module is based on the 11th Gen Intel® Core™ processor generation (codename “Tiger Lake UP3”). Built on 10nm process technology the processor integrates the next generation Intel micro architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The board is ideal for mission critical applications, that require the durability of a well-designed board including memory-down, 24/7 continuous operation, extended temperature specification, shock and vibration product performance and optional conformal coating.

11th Gen Intel® Core™ processor
Quad and dual core variants
Power efficient processors, TDP 12 to 28W
Rugged module design
24/7 operation
Extended temperature variants
Optional conformal coating
Long-term product availability
Integrated Intel® Iris® Xe graphics, max. 96 execution units
Up to 32GB LPDDR4X memory, chip-down, dual-channel
In-band ECC option
Two SATA 6Gb/s mass storage interfaces
Three DisplayPort/HDMI interfaces
LVDS and Embedded DisplayPort interface
Up to four independent displays
DirectX 12, OpenGL 4.6, OpenCL 1.2/2.x driver support
Four USB 3.1 Gen1/2 and eight USB 2.0 interfaces
Two UARTs
Up to nine PCI Express™ Gen 3 lanes
One Gb Ethernet port
TSN, TCC support
UEFI Firmware
Trusted Platform Module TPM 2.0

September 28, 2020

MSC C6C-EL

The MSC C6C-EL module is based on Intel‘s multi-core system-on-chip (SOC) Atom generation (codenamed “Elkhart Lake”). Built on 10nm process technology the SoC integrates the next generation Intel Atom processor core architecture and graphics accelerators, memory controller and rich I/O functionality into a single package. The module is designed for extended temperature range and 24/7 operation making it an ideal platform for mission critical tasks that require a reliable and performant compute base.

Intel Atom® x6000E Series processor
Intel® Pentium® N and J Series processor
Intel® Celeron® N and J Series processor
Quad and dual core variants
Power efficient processors, TDP 6 to 12W
Extended temperature variants
Integrated Intel® UHD Graphics, max. 32 executing units
Up to 32GB DDR4-3200 SDRAM, dual-channel
In-band ECC option
Two SATA 6Gb/s mass storage interfaces
UFS mass storage option
DisplayPort/HDMI interface
LVDS/Embedded DisplayPort interface
Three independent displays supported
DirectX 12, OpenGL 4.5/ES 3.x, OpenCL 1.2 driver support
Two USB 3.1/2.0 and six USB 2.0 interfaces
Two UARTs
Up to eight PCI Express™ x1 lanes
One Gb Ethernet port
TSN, TCC support
UEFI Firmware
Trusted Platform Module TPM 2.0

September 25, 2020

conga-TCA7

COM Express Type 6 Compact based on Intel® Atom® x6000E, Intel® Pentium® and Celeron® J processor series

– High performance Intel® UHD Graphics (Gen11)
– Options for Industrial Temperature Range -40°C to 85°C
– Time Sensitive Networking and Time Coordinated Computing for improved Realtime Capability
– Up to 4.267 MT/s onboard Memory Support with Inband ECC
– UFS 2.0 for higher bandwidth and data processing (optional)