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The MSC C6C-WLU module is based on Intel‘s 8th generation Core processor family. The Intel multi-chip-package in 14 nm technology includes processor, graphics and chipset on one carrier. It allows for ultra compact high-performance solutions in applications, where real-estate and cooling is constrained. The MSC C6C-WLU introduces 4 processor core capability based on the Intel Core U processor family. Customers can choose from a variety of quad and dual-core processors to scale performance and capabilities with application requirements. The board provides triple independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.1/2.0 interfaces complete the compact and power saving module. Besides an extensive set of interfaces and features, the MSC C6C-WLU optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 1.4b and DVI as well as up to four USB 3.1 interfaces supporting the fastest peripherals currently available. For wireless applications such as Industrial IoT, the module can be provided with optionally available Wi-Fi module supporting up to 2×2 IEEE 802.11ac wireless networks, and Bluetooth® 5.

Intel® Core™ 8th Generation
Intel® Core™ i7-8665UE quad-core 1.7/4.4 GHz, 8MB L2, 15W TDP
Intel® Core™ i5-8365UE quad-core 1.6/4.1 GHz, 6MB L2, 15W TDP
Intel® Core™ i3-8145UE dual-core 2.2/3.9 GHz, 4MB L2, 15W TDP
Intel® Celeron® 4305UE dual-core 2.0 GHz, 2MB L2, 15W TDP
Integrated Intel® UHD Graphics 610, 620
Up to 16 GB DDR4-2400 SDRAM, dual-channel, memory down
Two SATA 6Gb/s mass storage interfaces
Two DisplayPort/HDMI/DVI interfaces
Embedded DisplayPort / LVDS (24 Bit, dual channel) interface
Three independent displays supported
DirectX 12, OpenGL 4.5, OpenCL™
Resolution up to 4096 x 2304
Four USB 3.1/2.0 and four USB 2.0 interfaces
Eight PCI Express™ x1 lanes
Wi-Fi module with IEEE 802.11ac and Bluetooth® 5
Trusted Platform Module 2.0
UEFI Firmware

The MSC C6C-AL module is based on Intel‘s multi-core system-on-chip (SOC) Atom generation (codenamed “Apollo Lake”) that integrates next generation Intel processor core, graphics, memory, and I/O interfaces into one solution. Based on 14nm processor technology this multi-core Atom processor provides outstanding computing and graphics power and is more power efficient compared to its predecessors. The MSC C6C-AL brings triple independent display support, DirectX 12, fast DDR3L memory and four USB 3.0 on a compact, power saving and cost-efficient module. Different SOCs with dual- and quad-core processors are supported by this design. Besides an extensive set of interfaces and features, the MSC C6C-AL optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 1.4b and DVI. USB 3.0 interfaces support the fastest peripheral devices currently available. Supporting extended temperature range and long availability the modules are perfectly suited for modern IoT applications.

Intel Atom E3950 quad-core 1.6/2.0GHz, 12W
Intel Atom E3940 quad-core 1.6/1.8GHz, 9.5W
Intel Atom E3930 dual -core 1.3/1.8GHz, 6.5W
Intel Pentium N4200 quad-core 1.1/2.5GHz, 6W
Intel Celeron N3350 dual-core 1.1/2.4GHz, 6W
Integrated Intel Gen. 9 HD graphics
Up to 8GB DDR3L SDRAM, dual-channel
Two SATA 6Gb/s mass storage interfaces
MicroSD card socket
eMMC option
DisplayPort/HDMI/DVI interface
LVDS/Embedded DisplayPort interface
Three independent displays supported
DirectX 12, OpenGL 4.3, OpenCL 2.0
Dual MIPI-CSI (option)
Four USB 3.0/2.0 and four USB 2.0 interfaces
Two high-speed UARTs
Up to five PCI Express™ x1 lanes
UEFI Firmware
Trusted Platform Module
Extended temperature variants

COM Express Type 6 Compact module based on 11th Gen Intel® Core™ processor family (code name “Tiger Lake”) and soldered down memory

– Embedded/Industrial use condition
– Extended temperature options available
– PCI Express Gen 4
– Up to 32 GByte dual channel LPDDR4X soldered down memory with 4266 MT/ s IBECC
– AI/DL Instruction Sets including VNNI