COM Express Type 6 Compact module based on 12th Gen Intel® Core™ embedded mobile processors (code name “Alder Lake”)
– Intel® hybrid design combines Performance-cores with Efficient–cores
– Up to Intel® Iris® XeGraphics® architecture with up to 96 EUs
– PCI Express Gen 4 | USB 3.2
– AI Acceleration with Intel® Deep Learning Boost (VNNI)
– Embedded Use Condition SKUs
The MSC C6C-KLU module is based on Intel‘s 7th generation Core processor family. The Intel multi-chip-package in 14 nm technology includes processor, graphics and chipset on one carrier and allows extreme compact high-performance designs. The MSC C6C-KLU brings triple independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.0/2.0 interfaces complete the compact and power saving module. Different dual-core processors are supported by this design. Besides an extensive set of interfaces and features, the MSC C6C-KLU optionally offers hardware based security compliant to the requirements of TCG (Trusted Computing Group). The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 1.4b and DVI as well as up to four USB 3.0 interfaces supporting the fastest peripherals currently available.
Intel® Core™ 7th Generation
Intel Core i7-7600U dual-core 2.8/3.9GHz, 4MB L2, 15W TDP
Intel Core i5-7300U dual-core 2.6/3.5GHz, 3MB L2, 15W TDP
Intel Core i3-7100U dual-core 2.4GHz, 3MB L2, 15W TDP
Intel Celeron 3965U dual-core 2.2GHz, 2MB L2, 15W TDP
Integrated Intel® HD Graphics 610, 620
Up to 32 GB DDR4-2133 SDRAM, dual-channel
Three SATA 6Gb/s mass storage interfaces
MicroSD card socket
Two DisplayPort/HDMI/DVI interfaces
Embedded DisplayPort / LVDS (24 Bit, dual channel) interface
Three independent displays supported
DirectX 12, OpenGL 4.4, OpenCL 2.x
Resolution up to 4096 x 2304
Four USB 3.0/2.0 and four USB 2.0 interfaces
Eight PCI Express™ x1 lanes
Trusted Platform Module
UEFI Firmware
The MSC C6C-RYZ module is the embedded platform for the AMD RyzenTM Embedded V1000 and R1000 processor family. This versatile system-on-chip (SoC) technology combines processing, graphics and I/O functionality on a single die, allowing for outstanding compute performance in environments with constrained real-estate, power and cooling. Customers can choose from a variety of quad and dual-core processors to scale performance and capabilities according to application requirements. The board provides up to four independent display support with up to 4k x 2k resolution, highest level graphics acceleration and hardware based video en-/decoding. Fast DDR4 memory and multiple USB 3.1/2.0 interfaces complete the compact and power saving module. The MSC C6C-RYZ offers hardware based security compliant to the requirements of TCG (Trusted Computing Group) and features TPM 2.0 capability. The Type 6 pin-out allows direct access to the latest digital display interfaces like DisplayPort, HDMI 2.0b and DVI as well as up to four USB 3.1 interfaces supporting the fastest peripherals currently available
AMD Ryzen™ Embedded Series
AMD RyzenTM Embedded V1807B, quad-core Processor (3.35/3.8GHz, 11 GPU CU, 35-54W TDP)
AMD RyzenTM Embedded V1756B, quad-core Processor (3.25/3.6GHz, 8 GPU CU, 35-54W TDP)
AMD RyzenTM Embedded V1605B, quad-core Processor (2.0/3.6GHz, 8 GPU CU, 12-25W TDP)
AMD RyzenTM Embedded V1404B, quad-core Processor (2.0/3.6GHz, 8 GPU CU, 12-25W TDP), industrial temperature range
AMD RyzenTM Embedded V1202B, dual-core Processor (2.3/3.2GHz, 3 GPU CU, 12-25W TDP)
AMD RyzenTM Embedded R1606G, dual-core Processor (2.6/3.5GHz, 3 GPU CU, 12-25W TDP)
AMD RyzenTM Embedded R1505G, dual-core Processor (2.4/3.3GHz, 3 GPU CU, 12-25W TDP)
Up to 32 GB DDR4-3200 SDRAM, dual-channel, optional ECC
Two SATA 6Gb/s mass storage interfaces
Three DisplayPort/HDMI/DVI interfaces
Embedded DisplayPort / LVDS (24 Bit, dual channel) interface
Up to four independent displays supported
DirectX 12, OpenGL 4.6, OpenCL 2.1
Resolution up to 4096 x 2160
Up to four USB 3.1/2.0 and four USB 2.0 interfaces
Up to eight PCI Express™ x1 lanes
PEG configurable up to 1×8 or 2×4
Trusted Platform Module TPM 2.0
UEFI Firmware
