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The MSC C6C-ALN features the Intel® Atom® processors x7000E Series, Intel® Core ™i3 processor and Intel® Processors N Series. The CPU architecture is based on the same Efficient-cores and Intel® UHD graphics driven by Xe architecture as the 12th Gen Intel® Core™ processors, thus easing up application migration across Intel® CPU performance and power ranges. With support for up to eight processor cores, the module fits to a wide range of applications including point-of-sales terminals, digital signage controllers, HMI solutions and medical equipment.

The MSC C6C-ALN can drive up to three independent displays with a maximum of 4k resolution. The COM Express Type 6 interface allows direct access to digital display interfaces including DisplayPort, HDMI, VGA, and the choice of LVDS versus eDP. With a maximum capacity of 16GB fast DDR5 memory the board satisfies even demanding applications. Optional in-band ECC capability allows for protecting code and data kept in memory. High speed IO includes up to six PCIe Gen 3 lanes and up to four USB 3.1 interfaces. Mass storage is provided with the optional on-board eMMC memory and externally accessible via up to two SATA channels. The network interface based on Intel® i226 supports up to 2.5GbE bandwidth. System investments are well protected through long term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.

ADLINK Express-RLP Key Features:
• 13th Gen Intel® Core™ Mobile Processor
• COM Express Rev. 3.1
• Up to 14 cores, 20 threads at 15W/28W/45W TDP
• Up to 64GB DDR5 SO-DIMM at 4800 MT/s, IBECC
• AI inferencing (AVX-512 VNNI, Intel® Iris® Xe)
• PCIe Gen4, 4x displays / 2x USB4
• Extreme rugged operating temperature (option)

ADLINK’s Express-RLP COM Express Type 6 Basic size module is based on 13th Gen Intel® Core™ mobile processor and is the first COM Express utilizing Intel’s advanced hybrid architecture (with up to 6 Performance-cores and 8 Efficient-cores) offered with industrial-grade option to provide superior performance for edge IoT innovations across varied power ranges — at 15W/28W/45W TDP.

The module provides support for PCIe 4.0 and DDR5 memory with up to 4800 MT/s, 4 display or USB4/TBT4 via DDI/LVDS, and features integrated Intel® Iris Xe graphics with up to 96EUs, allowing for instantaneous on-device AI performance.

Equipped with Intel® TCC (Time-Coordinated Computing) and TSN (Time Sensitive Networking) support, the Express-RLP ensures timely execution of deterministic, hard real-time workloads with ultra-low latency, making it well suited for mission-critical AIoT use cases, including industrial automation, AMR (Autonomous Mobile Robot), autonomous driving, medical imaging, video broadcasting, and more.

The Relio R3 is a solid-state 3U rackmount computer designed for industrial and commercial applications requiring high reliability, maximum I/O expansion, scalable processing, and a long product life cycle.

Building on the advantages of COM Express architecture, the R3 features an Intel Atom® N2800 1.8GHz dual-core processor with 4GB RAM. The system requires low power consumption while operating fanless over a wide operating temperature range of 0°C to 50°C. Standard features include dual Gigabit Ethernet, four SeaLATCH locking USB 2.0 ports, three serial ports, DisplayPort video, and audio interfaces. The system includes a 7” LCD touchscreen on the front panel for a convenient operator interface.

With a total of 18 SeaRAQ™ I/O expansion slots, the R3 offers unprecedented expansion capabilities supporting a variety of real-world analog I/O configurations such as A/D inputs, 4-20mA outputs, 0-20mA inputs, thermocouples, and RTD inputs. Optically isolated inputs, relay outputs, and additional serial interfaces are also available. The system offers one PCI Express slot compatible with any half-length PCIe x1 board.

The Relio R3 operates from your choice of 2.5″ SATA solid-state disk (SSD) that can be integrated and preloaded with Microsoft Windows or Linux 32-bit operating systems. Operating from solid-state disk, the system is perfect for industrial and commercial rackmount environments including process control, test & measurement, and HMI applications.

Extended temperature range and other options are available. If you have application-specific requirements, call today to discuss a Sealevel custom COM Express solution.

3U rackmount enclosure with powder-coated finish

Silent solid-state design with no fans or other moving parts

Eighteen expansion slots for optional analog, digital and serial I/O

Integrated 7” LCD touchscreen operator interface

Wide temperature operation from 0°C to 50°C ambient

COM Express Type 6 Module supports Intel dual-core Atom processors