Archives

Express-SL/SLE: COM Express Basic Size Type 6 Module with 6th Gen Intel® Core™, Xeon® and Celeron® Processors (formerly codename: Skylake)

Key Features
– 6th Gen Intel® Core™, Xeon® and Celeron® Processor with Intel QM170/HM170/CM236 Chipset (codename: Skylake)
– Up to 32GB dual channel ECC or non-ECC DDR4 at 2133 MHz
– 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays
– 8 PCIe x1 and 1 PCIe x16
– GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions
– Extreme Rugged operating temperature: -40°C to +85°C (build option for Core & Celeron 25W TDP SKUs)

cExpress-BW: COM Express Compact Size Type 6 Module with Intel Pentium, Celeron N3000 Series and Atom x5 E8000 SoC (formerly codename: Braswell)

Key Features
– Intel Atom x5 E8000, Pentium N3710 and Celeron N3160/N3060/N3010 Series System-on-Chip (codename: Braswell)
– Up to 8 GB dual channel DDR3L at 1600 MHz
– 3x DDI, 1x eDP (optional LVDS in place of eDP), and suppoorting 3 independent displays
– GbE, three PCIe x1 (opt. five PCIe x1 with bridge)
– 2x SATA 6Gb/s (SATA0, SATA1)
– 4x USB 3.0/2.0 and 4x USB 2.0
– Smart Embedded Management Agent (SEMA®) functions

Express-KL/KLE: COM Express Basic Size Type 6 Module with 7th Gen Intel® Core™ 7000 series and Intel® Xeon® Processors (formerly codename: Kaby Lake)

Key Features
– 7th Gen Intel® Core™ 7000 series and Intel® Xeon® Processors
– Up to 32 GB Dual Channel DDR4 at 1867/2133 MHz supports both ECC and non-ECC memory)
– 3x DDI channels, 1x LVDS (or 4 lanes eDP), supports up to 3 independent displays
– 8x PCIe x1 (Gen3) and 1x PCIe x16 (Gen3)
– GbE, 4x SATA 6 Gb/s, 4x USB 3.0 and 4x USB 2.0
– Supports Smart Embedded Management Agent (SEMA) functions
– Extreme Rugged operating temperature: -40°C to +85°C (build option for 25W TDP SKUs)