Archives

November 7, 2022

COM Express Carrier Board, Type 6, ATX Form Factor

Get your COM Express project off to a fast start with the Express-BASE6 COM Express carrier board. The Express-BASE6 supports Basic and Compact Type 6 COM Express modules. Standard features include seven PCI Express X1 slots, one PCI Express X16 slot, one PCI Express Mini slot, LPC-based Super I/O and dual BIOS support. The carrier board includes connectors for digital and analog video, USB, Ethernet, SATA, serial and audio interfaces. Specific features are COM Express module dependent.

The Express-BASE6 simplifies software development and prototyping while the target application carrier board is designed. Take advantage of Sealevel’s carrier board development services for the fastest time to market. Our extensive library of proven I/O circuits including serial, analog, and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application.

Features

COM Express Type 6 reference carrier board in standard ATX form factor

Supports Basic and Compact Type 6 COM Express modules that are compliant with PICMG COM Express Revision 2.0

Includes seven PCI Express X1 slots, one X16 slot, and one Mini PCI Express slot

Three Digital Display Interfaces (DDI) supporting DisplayPort, HDMI, and DVI displays

Integrated Realtek high definition audio codec

Integrated Winboard Super I/O on LPC bus

Integrated I2C to GPIO bridge for digital I/O

Onboard diagnostic LEDs for BIOS post code data and address on LPC bus

Onboard socket for secondary SPI flash BIOS

Two 220-pin COM Express Type 6 connectors

One DB15 for analog VGA display

One 34-pin header for LVDS

One 8-pin header for flat-panel control

Four SATA connectors (module dependent)

One Gigabit (10/100/1000BaseT) Ethernet RJ45 port

Up to Eight USB 2.0 ports (Up to four ports can be USB 3.0 if supported by module)

One DB9M serial port; one 10-pin header for serial interface

Six 3.5mm connectors for microphone/audio line-in and line-out

Two 6-pin mini-DIN connectors for keyboard and mouse

One 20-pin header for LPC bus debug

One 10-pin header for Smart Battery management communications

Additional connectors for SMBus, I2C, reset, power LED, HDD LED, buzzer and module control signals

ATX form factor works with standard ATX power supplies and enclosures

November 4, 2022

COM Express Module, Type 6, 1.7GHz Intel Core i7

The IBR-i7-3517UE COM Express Type 6 module features an Intel Core i7-3517UE dual-core 1.7GHz processor and supports up to 16GB of 1600MHz DDR3 RAM. The module offers low power consumption (TDP 8W) and can operate fanless over an extended operating temperature range of -40°C to 85°C ambient, while the 2.3mm thick PCB is ideal for high vibration environments. Standard features include integrated Gigabit Ethernet controller, up to seven PCI Express X1 lanes, one PCI Express X16, two SATA III (6Gb/s) interfaces, two SATA II (3Gb/s) interfaces, eight USB 2.0 ports, four USB 3.0 ports, LPC bus, SMBus and I2C bus. The module includes three Digital Display Interfaces (DDI) for DisplayPort, HDMI or DVI displays.

Sealevel specializes in COM Express carrier boards built to your specific application requirements. Our extensive library of proven I/O circuits including serial, analog, and digital functionality simplifies the design process and can be easily optimized to meet the specific I/O count, voltage ranges and connector types required for your application. COM Express development boards are also available to allow software development to begin immediately while the custom carrier board is designed.

Turn to Sealevel’s custom capabilities for expertise in electrical, mechanical, software, environmental stress screening, project management, and compliance & certification. Call us today to discuss the design capabilities, reliability improvements and design control advantages that a Sealevel COM Express carrier board or system design will bring to your next product.

COM Express Basic with Type 6 connector layout

Includes 1.7GHz (up to 2.8GHz Turbo) Intel Core i7-3517UE dual-core processor

Maximum 16GB DDR3 1600MHz RAM via dual 204-pin SODIMM slots

Integrated Mobile Intel QM77 Express chipset

Variety of I/O interfaces can be included

Extended temperature operation from -40°C to 85°C ambient

April 19, 2022

PCOM-B657VGL

PCOM-B657VGL is a COM Express module based on Intel® 11th Gen H Processor, which is compatible with COMe 3.0 standard. The platform adopt 10nm++ process and support VNNI instruction set, offers advance computing power with 45W~25W thermal and industrial grade power management.

Features:
1.11 Gen Intel® Core™, Celeron®, and Xeon® W-11000E Series processors in 10nm Super Fin Process technology
2.AI/DL Instruction sets Support (Intel VNNI, AVX-512, INT8, FP16)
3.Up to 8C/16T@45W and 25W with Industrial temperature SKUs
4.DDR4 SO-DIMM, PCIe Gen 4.0 x16, and 8x PCIe Gen 3.0 x1
5.Complete Support of 3x DDI, eDP/LVDS, and VGA
6.Support Intel® TCC/TSN with 2.5GbE