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The NAMC-8569-E3/DS3 is an Advanced Mezzanine Card (AMC) with a powerful Freescale Power QUICC III MPC8569 processor providing access to DS3/E3 interfaces in next generation systems based on MTCA and ATCA standards. The TDM-to-ITDM converter connects the onboard DS3/E3 interface with a Gigabit Ethernet port for system interconnect (I-TDM).

The NAMC-8569-E3/DS3 is dedicated for (tele-)communication applications with extensive need for a high aggregation of DS3/E3 interfaces combined with access to switched networks based on high bandwidth Ethernet.

The chipset on the submodule consists of a line interface unit (LIU) from Maxim-Dallas (DS3251) that connects to a multiplexer/demultiplexer chip from PCM-Sierra (TEMUX84) to get access down to DS0 level.

The DS3/E3 framer interfaces to the on-board timeslot interchanger (TSI) chipset. The TSI as well as the TDM-to-ITDM bridge are incorporated in an ECP3 FPGA from Lattice. The TSI allows flexible routing as well as multi-casting of 64kbps timeslots between the various DS3/E3 streams. The TDM-to-ITDM bridge converts the TDM oriented bit stream into Ethernet packets and vice versa.

The MPC8569 offers a maximum TDM processing capability of 512 64kbps channels.

Access to just 8 or 16 E1/T1 lines can be provided by a derivate of the NAMC-8569-E3/DS3, the NAMC-8569-xE1.

System Processor and Memory
– powerful Freescale Power QUICC III MPC8569
– e500 PowerPC core combined with dedicated
– interface hardware and four RISC cores
– core frequency with up to 1.3GHz
– 128-1024 MB DDR2 SDRAM, 128 MB FLASH memory

E1/T1 Access
– on-board framer provides access to a DS3 – line at the front panel
– standard framing formats and
– T1 Super Frame (SF)
– T1 Extended Super Frame (ESF)
– T1 Digital Multiplexer (DM)
– T1 Switch Line Carrier -96 (SLC-96)
– E1 G.704 and G.706 (CRC-4 multiframe)

TDM and I-TDM Interface
– on-board timeslot interchanger (TSI) and TDM-to-ITDM bridge incorporated in an ECP3 – FPGA from Lattice
– flexible routing, multicasting of 64kbps timeslots
– optional 32MHz clocked H.110-alike TDM backplane interface on AMC connector(extended area).

Fabric Support
– Fat Pipe PCIe: one x1 (port 4 or 8) or one x4 (ports 4-7 or 8-11) or
SRIO: two x1 (port 4 and 8) or one x4 (port 4-7 or 8-11).
PCIe and SRIO: one x1 PCIe (port 4) and one SRIO (port 8).
– Base Fabric
Two 1000BaseX interfaces at port 0 and port 1 of the common options region of the AMC backplane connector.

NAMC-8569-ATM

Advanced Mezzanine Card (AMC) CPU Board featuring data exchange between
optical OC3/STM1 ATM traffic, Ethernet and TDM data

Flexibility, high-bandwidth and low latency processing dedicate the NAMC-8569-ATM for applications in telecommunication and defence communication market.

The front Ethernet interface can be switched or multiplexed towards the CPU and the backplane. Depending on the required throughput one Fat Pipe (PCIe or SRIO) or the combination of both Fat Pipes (PCIe and SRIO) are available to the backplane. Thus, the NAMC-8569-ATM is targeting at ATM based applications where IO boards need PCIe and where low latency of SRIO for multiprocessing is requested.

Latest Freescale PowerQUICC® III MPC8569 processor:
– dual Multichannel Communication Controller (MCC)
– higher core frequency than predecessor PowerQUICC III processors
– up to 1GB DDR2 SDRAM at 800MHz, 128MB flash

Lattice FPGA
– up to 70.000 logic cells

Interfaces at front panel
– 1x Gigabit Ethernet (GbE)
– 2x OC3 SFP

Backplane connections
– 2x Gigabit Ethernet (GbE)
– Serial Rapid IO (SRIO)
– PCI Express (PCIe)

TDM and I-TDM
– 125 μs and 1 ms I-TDM modes as well as TDM cross-connect supported

The VT855 is a 1U μTCA chassis that provides two mid size AMC slots or two double module mid size with direct connection between the two slots on ports 4-7, 8-11 and 17-20. The ports 2-3 are routed directed between the two slots or to dual 2.5″ disk. The AMC.2 (ports 0 and 1) are routed to the on board GbE switch. The Air Filter and Fan Trays are hot swappable. The VT855 has option for AC or DC input.