Tria Technologies, an Avnet company specializing in embedded compute boards, is launching five new product families powered by Qualcomm Dragonwing and Snapdragon platforms at its Embedded World debut. Tria is a leading module vendor with the largest SMARC portfolio in the market, and this announcement strengthens their technology portfolio with new embedded modules.

“We are very excited about our relationship with Qualcomm Technologies and showcasing our new modules, which are applicable to a wide range of low- to high-end applications,” said Daniel Denzler, Senior Director, Business Line Management for Boards and Systems, Tria Technologies. “This new module family based on Dragonwing platforms enables us to address virtually any requirement, conserving power, upgrading performance and delivering AI capabilities for use in challenging environments, across a range of module standards.”

“Dragonwing processors are designed to provide high-performance, low-power edge computing and on-device AI, enabling industries to achieve new heights of innovation and efficiency,” said Douglas Benitez, Senior Director, Business Development for Qualcomm Europe, Inc. “We are excited to see how Tria’s new embedded modules will empower industrial customers to push the boundaries of what is possible with AI.”

The technologies offer powerful computing, power efficiency, making them ideal for the new generation of IoT devices. The enhanced AI performance opens new markets for AI deployment at the edge.

The Tria products demonstrated in the Qualcomm Technologies area of Tria’s stand at Embedded World 2025 will include:

· Tria IQ-9075 Vision AI-KIT powered by the Dragonwing IQ-9075 Processor

· Tria SMARC QCS6490 powered by the Dragonwing QCS6490 Processor

· Tria SMARC QCS5430 powered by the Dragonwing QCS5430 Processor

· Tria IQ-615 (OSM and SMARC) powered by the Dragonwing IQ-615 Processor

· Snapdragon X Elite (Com Express and Com HPC) powered by the Snapdragon X Elite Platform

One of several advantages of Tria’s new modules is that they are designed and manufactured in Germany.

Ongoing demonstrations of the new modules and more can be found on an area of Tria’s booth (Hall 3A Booth 225) dedicated to Qualcomm Technologies during Embedded World from 11–13 March 2025 in Nuremberg, Germany.

More than 45 PICMG members will be exhibiting at Embedded World 2024. For the first time at the world’s largest trade fair dedicated to embedded technology, PICMG is the subject of two technical conference tracks. We’ll be hosting a 30th Anniversary Reception on Wednesday, April 10th, that’s open to all PICMG members as well as the press; we expect more than 150 attendees.

There is a lot of excitement around PICMG at Embedded World 2024, but those activities don’t even mention all the PICMG-related news released ahead of and during the show. From exciting industry partnerships to new branding, here are some of highlights from the PICMG news releases you’ll see around Embedded World 2024.

• PICMG Celebrates Its 30th Anniversary—To celebrate this milestone, PICMG is rolling out all new branding, with new logos for all related specifications, in Hall 5, booth 5-342 at this year’s Embedded World in Nuremberg.
• PICMG, OPAF Partnership to Advance Open Process Control Technology—The partnership fills a gap in edge controller hardware that exists in the O-PAS™ Standard—an open architectural framework for developing industrial process automation systems, currently being defined by OPAF initiatives.
• PICMG ModBlox7 Specification To Be Showcased at 2024 Embedded World—In support of the ModBlox7 ratification, one of PICMG’s newest specifications, multiple members are collectively showcasing their newest products based on the spec at the 2024 Embedded World exhibition.
• PICMG Announces Release of InterEdge Standard for Open, Modular Process Control Systems—The IEC 61499 and IEC 61131-compatible InterEdge specification promises to revolutionize the industry with an interoperable, multi-vendor alternative to proprietary Industrial PCs (IPCs), Programmable Logic Controllers (PLCs), and Distributed Control Systems (DCSs).
• PICMG Bolsters New COM-HPC “Mini” Form Factor with Release of Carrier Design Guide Revision 2.2—This comprehensive document contains interface schematics, diagrams, design rules and requirements, and more for PCB layout engineers and hardware developers looking to create application-specific carrier boards that pair with COM-HPC modules.
• TO COME! An Announcement from PICMG and the DMTF!

The Show(s) Must Go On

We’re only through the first quarter of 2024 and we’ve seen two new specification families introduced, multiple new specifications released, a call for participation on a new version of a familiar technology (AdvancedTCA), strengthened partnerships with multiple standards organizations, and more.

Later this month PICMG will be sponsoring the IEEE Real-Time Conference (RTC) in Vietnam, which serves as rallying point for a critical emerging deep tech economy (https://indico.cern.ch/event/940112/program). We will act as an umbrella for multiple members who develop and deliver products into this sector, and also participate in a Women in Engineering (WiE) event (https://indico.cern.ch/event/940112/page/33210-women-in-engineering-wie-event).

Later this year we will visit Embedded World North America in Austin, the MicroTCA Summit in Hamburg, and many more in-person and virtual events in between. Right now is one of the more exciting times in PICMG’s 30-year history, and I feel fortunate to be part of it.

(Editor’s note: If you’d like to attend the 30th Anniversary Reception and have yet to receive an invite or RSVP, contact [email protected], [email protected], or [email protected] to get on the list or schedule a meeting).

Next-generation AI computing for the edge 

Deggendorf, Germany, 20 December 2023 * * * congatec – a leading vendor of embedded and edge computing technology – is introducing its latest range of COM Express Compact modules based on the Intel^® Core™ Ultra processors. Providing a unique combination of heterogeneous compute engines, including CPU, GPU and NPU, the new modules are an ideal fit to run demanding AI workloads at the edge.

Next to the powerful P-cores and efficient E-cores for general computing and the high-performance Intel^® Arc™ GPU for graphics-intensive tasks, the integrated Neural Processing Unit (NPU) called Intel^® AI Boost contributes advanced neural processing capabilities to the overall computational architecture. The integrated NPU enables highly efficient integration of advanced artificial intelligence workloads at lower system complexity and costs than discrete accelerators. This makes the new Intel Core Ultra processor-based Computer-on-Modules especially beneficial for combining high-performance real-time computing with powerful AI capabilities in surgery robots and medical imaging and diagnostic systems, where automatically generated critical findings can support medical personnel. Other application targets are situational awareness in industrial applications such as inspection systems, stationary robotic arms, autonomous mobile robots (AMRs), and autonomous guided vehicles (AGVs), to name just a few.

“The new conga-TC700 COM Express Compact Computer-on-Modules provide application-ready AI capabilities in a plug-and-play form factor. Its ecosystem of customer solution-focused products and services significantly improves the time-to-market for implementing the latest state-of-the-art x86 with powerful AI capabilities as required in industrial process control, microgrid controller, medical ultrasound and x-ray, automated check-out terminals, powerful AMRs, and many more,” says Tim Henrichs, VP Global Marketing & Business Development at congatec. “OEMs can simply upgrade existing applications by exchanging the module and instantly gain access to cutting-edge AI technologies. It has never been easier to integrate artificial intelligence in x86-based systems.”

The feature set at a glance

The new conga-TC700 COM Express Compact Computer-on-Modules with Intel Core Ultra processors (code named Meteor Lake) are among the most power-efficient x86 client SoCs available on the market. Up to 6 P-Cores, up to 8 E-Cores, and 2 Low Power E-Cores support up to 22 threads, making it possible to consolidate distributed devices onto a single platform for the lowest total cost of ownership. The SoC-integrated Intel Arc GPU with up to 8 Xe Cores and up to 128 EUs can handle stunning graphics up to 2x 8K resolution and ultra-fast GPGPU-based vision data (pre)processing. The integrated NPU Intel AI Boost executes machine learning algorithms and AI inferences particularly efficient. Up to 96 GB DDR SO-DIMM with in-band ECC at 5600 MT/s contributes to power-efficient high data throughput and low latency.

The modules are supported by congatec’s OEM solution-focused high-performance ecosystem, including highly efficient active and passive cooling solutions and ready-to-use evaluation carrier boards. Customers can order the modules with pre-evaluated real-time hypervisor technology from Real-Time Systems for virtual machine deployments and workload consolidation in edge computing scenarios. Service offerings include shock and vibration tests for custom system designs, temperature screening, and high-speed signal compliance testing, along with design-in services and all required training sessions to simplify the use of congatec’s embedded computer technologies to round off the ecosystem.

The new conga-TC700 COM Express Compact Type 6 modules support the embedded temperature range from 0 °C to 60 °C and are available in the following standard configurations:

All features of the new Intel Core Ultra processor-based conga-TC700 COM Express Compact modules can be found here: https://www.congatec.com/en/products/com-express-type-6/conga-tc700/

For more information on the innovative Intel Core Ultra processor platform please visit https://www.congatec.com/en/technologies/intel-meteor-lake-h-based-computer-on-modules/

You can experience these and other innovations at embedded world from 9-11 April 2024: https://www.congatec.com/en/congatec/events/congatec-at-embedded-world-2024/

Visit congatec in Hall 3 at Stand 241

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About congatec 

congatec is a rapidly growing technology company focusing on embedded and edge computing products and services. The high-performance computer modules are used in a wide range of applications and devices in industrial automation, medical technology, robotics, telecommunications and many other verticals. Backed by controlling shareholder DBAG Fund VIII, a German midmarket fund focusing on growing industrial businesses, congatec has the financing and M&A experience to take advantage of these expanding market opportunities. congatec is the global market leader in the computer-on-modules segment with an excellent customer base from start-ups to international blue chip companies. More information is available on our website at www.congatec.com or via LinkedIn, X (Twitter) and YouTube.