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The HEITEC HeiPac Vario VM-R CPCI-S is a 4U vertical-mount chassis that holds up to eight 3U slots at a 0.8” pitch. The modular card guides can be adjusted to allow 1.0” pitch or other spacing in .2” increments. The standard PSU is a fixed 350W ATX, but other options are available. Conduction-cooled card guides are also available for testing and development. The chassis is 42HP wide, other versions are available in 19″ rackmount or specialty sizes.

The HeiPac Vario VM-R CPCI-S has various power and backplane configuration options. Consult HEITEC for off-the-shelf options and tailored configurations.

– 4U vertical-mount chassis platform that accepts 3U CompactPCI Serial boards
– Supports RTMs for rear I/O
– Up to 8 slots at 0.8” pitch
– Card guides can be adjusted in .2” increments to accept various slot pitches
– Bottom-to-top cooling configuration. Front-to-rear cooled version is also available.
– Fixed 250W ATX (other PSU options are available upon request)
– Low cost design
– Optional rubber “feet” for desktop applications
– Customization available

The HeiSys system platform combines the advantages of existing and established plug-on modules and offers full scalability of computing power on the one hand and on the other hand, multidimensional modularity in terms of communication and I/O interfaces.

Depending on the application and the requirements for computing power, datarate, signal diversity and power consumption, suitable COM Express boards can be selected.
Together with a self-developed FPGA SMARC module a large variance of interfaces can be mapped. This allows the realization of vehicle/field buses such
as MVB, Profibus, CAN and EtherCat.
A wide choice of wireless standards is supported via multiple M.2 connectors. The system platform is designed for the use of Wi-Fi, GSM, UMTS, LTE, 5G, LPWAN, LoRaWAN, Wi-Fi, Bluetooth and GPS/GLONASS multiband radio modules for industrial and railway operations.

This eliminates the need for complicated, time-consuming assembly or the timeconsuming coordination of various components.
The compact system is certified for mobile use as a rolling stock or for wayside monitoring by the approval according to EN 50155. Due to the absence of moving parts such as fans, the reliability and the MTBF is significantly increased. The system guarantees operation in an extended temperature range between -40 °C and +85 °C.
The system platform is excellently suited e.g. for the medical, energy / transportation, industrial and digitalization sectors. The system can be used as a gateway, a passenger information system, a wireless-access-point or as diagnostic and monitoring system in the energy sector or transportation. In marine, trains or automotive applications HeiSys can be used as a board computer or for navigation.
HeiSys supports Windows 10 / IoT and all Linux distributions of current kernels. The concept uses main line drivers or the drivers provided by the corresponding modules to ensure proper commissioning and function.

Acromag’s XCOM-6400 is a basic size platform (95 x 125mm) processor module with Type 6 interconnects. Several models are available with the 4th generation (Haswell) Intel Core i7 or i5 CPUs. Designed for industrial and defense applications, the XCOM-6400 has an extra rigid PCB and extended temperature support.

The 4th generation of Intel’s i5 and i7 processors delivers many enhanced capabilities for media, graphics, security, and power management. Huge performance improvements were made for floating-point-intensive computations which are critical for digital signal and image processing applications such as radar and sonar. Enhanced graphics enable smoother playback of high quality images for digital signage or displays. Better power efficiency reduces heat and allows smaller, lighter designs with more portability.

Cutting-edge technology features programmable power limits, allowing the user to “dial-down” the maximum power consumption of the CPU in systems where power is a concern.

This module sets a new standard for shock and vibration by implementing a SODIMM hold down mechanism. Soldering down the memory is no longer necessary.

The XCOM-6400 also provides a heat sink capability not available on traditional COM Express designs. Conduction-cooled rails set a new standard for carrier cards.