February 17, 2022
EMC Front panels(FP): CompactPCI, cPCI Serial
Features:
Material: 2.5mm aluminum extrusion
Finish: Alochrom
Includes: Panel,ejector handles,EMC gaskets, collars with captive screw
Features:
Material: 2.5mm aluminum extrusion
Finish: Alochrom
Includes: Panel,ejector handles,EMC gaskets, collars with captive screw
Features:
EMC integrated system in 19″ rack mount
Aluminum enclosure
Dimension: 3U(H) x 84T(W) x 283mm(D)
4/6/8-slot 3U CompactPCI backplane
Front cage: 8-slot, 3U x 160mm
Rear I/O: 8-slot, 3U x 80mm
250 W ATX or 250 W cPCI power supply
1 x 5.25″ and 1 x 3.5″device holders
Customization is available
The MSC C6B-ALP COM Express module features the 12th Gen Intel® Core™ processor, giving application designers a great variety of choices of power efficient and performant compute solutions. Offering a great scalability of performance the module is ideal for compute intense applications in medical, transportation, video surveillance and gaming. The new Intel® performance hybrid architecture combines Performance-cores and Efficient-cores with the Intel® Thread Director providing intelligent workload optimization. The architecture scales up to fourteen cores and twenty threads at 45/35W thermal design power (TDP). For applications with need for lower power dissipation, selected processor variants can be operated down to 12W TDP.
For highest data throughput the module enables fast DDR5-4800 memory technology. Up to two SO-DIMMs can be installed for a total memory capacity from eight to sixty-four GB. I/O located on COM Express carrier designs can be connected to the module via eight PCIe lanes (mix of Gen 4/3) and an eight lane PEG port capable of PCIe Gen 4. The Ethernet interface provides up to 2.5GbE bandwidth based on the Intel i225 network controller. System investments are well protected through long-term availability of the module, designed, and manufactured by Avnet Embedded. In addition, the COM Express standard enables performance scaling and migrating applications to future technology upgrades when they become available.