Archives

January 10, 2022

conga-TC670

COM Express Type 6 Compact module based on 12th Gen Intel® Core™ embedded mobile processors (code name “Alder Lake”)

– Intel® hybrid design combines Performance-cores with Efficient–cores
– Up to Intel® Iris® XeGraphics® architecture with up to 96 EUs
– PCI Express Gen 4 | USB 3.2
– AI Acceleration with Intel® Deep Learning Boost (VNNI)
– Embedded Use Condition SKUs

January 5, 2022

Express-ADP COM Express Basic Size Type 6 Module with 12th Gen Intel® Core™ Processor

ADLINK Express-ADP Key Features:
• 12th Gen Intel® Core™ Processor
• Edge AI (VNNI, Intel® Iris® Xe graphics)
• DDR5 up to 4800 MT/s
• 16 PCIe Gen4 lanes
• USB4 / TBT4

ADLINK’s Express-ADP COM Express Type 6 Basic size module is based on the 12th Gen Intel® Core™ processor and is the first COM Express to support advanced hybrid architecture with up to 6 Performance-cores (P-cores) for IoT workloads and up to 8 Efficient-cores (E-cores) for background task management, boosting productivity and fueling IoT innovation across a wide variety of deployments.

The modules provide support for PCIe 4.0 and DDR5 memory with up to 4800 MT/s combined with increased cache, as well as security and manageability features, AI enablement to deliver intelligent workload optimization, enhanced graphics, AI, computer vision, and enhanced peripheral, connectivity, and fast memory access capabilities.

The integrated Intel® Iris® Xe graphics, with up to 96EUs, offers four concurrent 4K60 HDR displays and Intel® Deep Learning Boost to deliver superior AI performance. Using DDI, eDP 1.4b and USB4/TBT4, the four independent displays support Display Alternative mode, providing premium graphics features for superior content support, display and I/O virtualization.